Circuit ageing detection method based on self-oscillation circuit

An aging test and self-oscillation technology, applied in electronic circuit testing and other directions, can solve the problems of high test power consumption and inaccurate test accuracy, and achieve the effect of reducing test overhead, strengthening authenticity, and improving the defects of circuit aging degree.

Inactive Publication Date: 2013-05-22
HEFEI UNIV OF TECH
View PDF5 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to overcome the problems of high test power consumption and inaccurate test accuracy in the existing aging test methods, the present invention provides a circuit aging test method based on a self-oscillating circuit, w

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit ageing detection method based on self-oscillation circuit
  • Circuit ageing detection method based on self-oscillation circuit
  • Circuit ageing detection method based on self-oscillation circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] Combined with the S27 circuit example in the ISCAS'89 benchmark, see figure 1 , the present invention adopts the aging test scheme as follows:

[0034] Step 1. According to static timing analysis and inter-path correlation, select the set T of aging characteristic paths in the circuit:

[0035] (1) Using a static timing tool, analyze the timing of the circuit to be tested, and select paths whose timing margin is less than 20% to form a set G of paths to be tested. In integrated circuits, data paths with different structures have different aging degrees. This solution first separates each data path in the circuit, that is, finds each timing path to be tested; according to the specific structure of the data path, uses a static timing tool to analyze the timing of each path, and selects the one with a timing margin of less than 20%. The data paths form the path set G to be tested.

[0036] (2) Analyze the aging compatibility relationship between each path to be tested i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a circuit ageing detection method based on a self-oscillation circuit. The method includes choosing an ageing characteristic access collection T in a to-be-detected circuit according to static timing analysis and correlation among ways, remaining logical negation with odd power on each to-be-detected way in the ageing characteristic access collection T to form the self-oscillation circuit, producing a detection vector quantity to excite the self-oscillation circuit to produce a detection level signal by means of a detection production method of a fixed-type fault, and obtaining a circuit ageing characteristic value through the fact that a counter samples the self-oscillation circuit and measuring the ageing degree of the to-be-detected circuit. The method can precisely measure the ageing degree of the circuit at low power consumption, and provides precise bases for circuit ageing failure protection.

Description

technical field [0001] The invention relates to integrated circuit testing technology and reliability technology, especially in the aspects of aging prediction and protection of ultra large scale integrated circuits. Background technique [0002] The rapid development of semiconductor technology has improved the performance of integrated circuits. However, the process size of integrated circuits has been greatly reduced, which also makes the aging effect a major challenge affecting the reliability and service life of integrated circuits. Under nanoscale process conditions, negative bias temperature instability (NBTI), hot carrier injection (HCI), time-dependent breakdown (TDDB), and electromagnetic migration (EM) are the main factors leading to the aging of integrated circuits. The aging of integrated circuits will cause the increase of circuit delay and the degradation of circuit performance, and eventually lead to the failure of the circuit. According to the existing sta...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G01R31/28
Inventor 梁华国严鲁明蒋翠云黄正峰易茂祥欧阳一鸣陈田刘军
Owner HEFEI UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products