Single-phase bridge rectifier

Abstract

The invention discloses a single-phase bridge rectifier, relates to the improvement for a single-phase diode bridge rectifier structure, and provides the single-phase bridge rectifier which can improve a heat dissipation effect and relieve labor intensity. The single-phase bridge rectifier comprises a packaging body, a first frame, a second frame, a third frame, a fourth frame and four chips, an acute-angle corner, facing towards the first frame, of the second frame, two acute-angle corners of the third frame and an acute-angle corner, facing towards the first frame, of the fourth frame are respectively bent towards the direction where leads are arranged to form a section difference face which is parallel to each frame body, and N faces of the four chips are respectively welded on the plane of two acute-angle corners of the first frame, the plane of the acute-angle corner, facing toward the third frame, of the second frame, and the plane of the acute-angle corner, facing towards the third frame, of the fourth frame. All the chips are enabled to be arranged in a product in a consistent orientation mode to form a rectification return circuit. Due to the fact that all the large faces (N faces) face a heat dissipation face at the top, the heat dissipation effect of the product is improved. In addition, the single-phase bridge rectifier is placed in a single-surface mode, for an operator, careful discrimination is not needed, and labor intensity of the operator can be greatly relieved.

Description

technical field [0001] The invention relates to the improvement of the single-phase diode rectifier bridge stack structure. Background technique [0002] Single-phase diode rectifier bridge stack in the prior art such as Figure 4 , 5 As shown, the P side (small) of chip 1 61 and chip 4 64 faces downward, and the N side (big side) of chip 2 62 and chip 3 63 faces down. This structure has been used in this field until now. In production, the operator needs to carefully distinguish and place the chips. If there is a mistake in the placement, the finished product will be scrapped, requiring the operator to concentrate on it, which makes the labor intensity of the operator relatively high. Large, low production efficiency. Although the area of ​​the large surface and the small surface is not much different, when in use, the large surface is close to the heat dissipation surface to improve the heat dissipation effect of the product. Contents of the invention [0003] Aiming ...

AI Technical Summary

Problems solved by technology

This structure has been used in this field until now. In production, the operator needs to carefully distinguish and place the chips. If there is a mistake in the placement, the finished product will be scrapped, requiring the operator to concentrate on it, which makes the labor intensity of the operator relatively high. Large, low production efficiency

Images