Bridge rectifier DIP (Double In-line Package) brush coating process
A rectifier bridge stack and process technology, applied in the field of electronics, can solve problems such as affecting product reliability, and achieve the effect of reducing the phenomenon of die offset or displacement and small differences between batches
Active Publication Date: 2013-05-29
NANTONG HORNBY ELECTRONICS
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Problems solved by technology
[0006] 2) In terms of reliability: the crystal grains undergo a secondary high temperature of 360 degrees, which will affect the reliability of the product and lead to potential risks in product reliability;
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[0017] The process of the present invention is as follows: a rectifier bridge pile DIP glue brushing process, which mainly consists of three steps: glue brushing assembly welding, molding, and post-curing.
[0018] Step 1) Glue brushing assembly welding process: use screen printing to print solder paste to the frame process design area, then divide the chip through the suction cup, and use the suction pen to transfer to the frame process design area where the solder paste has been printed. Put the assembled material into the graphite boat and pass through the welding furnace (T peak =350-360℃) to weld the chip and the frame together.
[0019] Step 2) Molding process: The materials that have been welded, cleaned and dried are sealed with epoxy resin through an injection molding machine to protect the device from damage.
[0020] Step 3) Post-curing process: Place the plastic-encapsulated material in an oven and bake (baking condition 170-175°C / 7.5 hours) to fully harden the ep...
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The invention discloses a bridge rectifier DIP (Double In-line Package) brush coating process. The bridge rectifier DIP brush coating process mainly comprises a brush coating assembly and welding step, a mold pressing step and a post-curing step, and is characterized in that the brush coating assembly and welding step comprises the sub-steps of printing solder paste to a frame process design region by using silk-screen printing, diverging a chip through a suction cup, converting to the frame process design region, on which the solder paste has been printed, by using a pick-up pen, placing the assembled material in a graphite boat to weld the chip with a frame through a welding furnace (Tpeak is equal to 350-360 DEG C). The bridge rectifier DIP brush coating process has the advantages that: the thermal stress produced by secondary welding, the yield problem caused by mechanical damage and the potential risk of reliability problem of a product are reduced in the aspect of reliability; the efficiency of the brush coating process is increased about one time when compared with that of a pre-welding process, and the production efficiency is 33 k per a person per 12 hours to the minimum in the aspect of production efficiency; and the yield is improved to 97.17 percent in the brush coating process compared with the conventional pre-welding process, and the difference between batches is small.
Description
technical field [0001] The invention relates to the field of electronics, in particular to a rectifier bridge stack DIP brushing process. Background technique [0002] The process flow of the traditional craft is as follows: [0003] 1. Process flow chart such as figure 1 Shown: [0004] 2. Disadvantages: [0005] 1) In terms of yield rate: the grain has been subjected to a secondary high temperature of 360 degrees, which affects the yield rate, and the conventional electrical yield rate is up to 95%; [0006] 2) In terms of reliability: the crystal grains undergo a secondary high temperature of 360 degrees, which will affect the reliability of the product and lead to potential risks in product reliability; [0007] 3) The maximum production efficiency is: 16.8K / person / 12 hours; [0008] 4) Environmental protection: the pre-soldering process will paint a large amount of welding oil, which needs to be cleaned with chemical reagents, which will increase the pollution of ...
Claims
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IPC IPC(8): H01L21/50H01L21/56
Inventor 曹孙根
Owner NANTONG HORNBY ELECTRONICS