Unlock instant, AI-driven research and patent intelligence for your innovation.

Substrate support device

A technology for supporting devices and substrates, which is applied in gaseous chemical plating, coatings, electrical components, etc., and can solve problems such as difficulty in realization and high withstand voltage.

Active Publication Date: 2017-12-01
NHK SPRING CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when an aluminum oxide film is applied to a metal flat plate, the thickness of the aluminum oxide film is about 50 to 75 μm, and the withstand voltage is about 0.8 to 1 kV, making it difficult to achieve a higher withstand voltage.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate support device
  • Substrate support device
  • Substrate support device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0027] figure 1 It is a perspective view of the substrate supporting apparatus 100 according to one embodiment of the present invention. also, figure 2 It is a cross-sectional view of AA' in Fig. 1 . The substrate supporting device 100 according to the present embodiment includes a flat plate portion 110 and a shaft portion 150 , and the heating element 120 is arranged inside the flat plate portion 110 . A concave portion 113 for supporting the substrate is formed on the upper surface of the flat plate portion 110 , and a shaft portion 150 is connected to a central portion of the flat plate portion 110 opposite to the concave portion 113 . The shaft portion 150 has a hollow structure 170 . The hollow structure 170 of the shaft part 150 is connected to the heating element 120, and the wiring 160 connected to the external control device (not shown) is arrange|positioned.

[0028] In the substrate supporting device 100 , an insulating film 119 is formed on the substrate-supp...

Embodiment approach 2

[0046] image 3 is equivalent to the substrate supporting device 200 according to one embodiment of the present invention figure 1 Sectional view of A-A' position. The substrate supporting device 200 according to the present embodiment includes a flat plate portion 210 composed of three members 210 a , 210 b , and 210 c instead of the flat plate portion 110 . The heat generating body 120 is configured by forming a groove in the member 210a or 210b. In addition, a groove is formed in the member 210b or 210c, and a refrigerant flow path 290 is arranged. A concave portion 213 for supporting the substrate is formed on the upper surface of the flat plate portion 210 , and the shaft portion 150 is connected to a central portion of the flat plate portion 210 opposite to the concave portion 213 . Since the shaft portion 150 is the same as that described in Embodiment 1, detailed description thereof will be omitted.

[0047] In the substrate supporting device 200 , an insulating fi...

Embodiment approach 3

[0058] Figure 4 is equivalent to the substrate supporting device 300 according to one embodiment of the present invention figure 1The cross-sectional view of the AA' position. In the substrate supporting device 300 according to the present embodiment, instead of the flat plate portion 110 , the flat plate portion 310 having corners chamfered is used. Grooves are formed in the member 310a or 310b to arrange the heating element 120 . A concave portion 313 for supporting the substrate is formed on the upper surface of the flat plate portion 310 , and the shaft portion 150 is connected to a central portion of the flat plate portion 310 opposite to the concave portion 313 . The shaft portion 150 is the same as that described in Embodiment 1, and thus detailed description thereof will be omitted. Also as described in Embodiment 2, grooves may be formed on the member 310b or 310c to configure the refrigerant flow path.

[0059] In the substrate supporting device 300 , an insulat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention provides a substrate supporting device made of metal with high withstand voltage and high heat resistance. The substrate supporting device of the present invention includes: a substrate portion formed of metal; a shaft portion connected to the flat plate portion and formed of metal; a heating element arranged inside the flat plate portion; and a shaft portion formed on the flat plate portion by ceramic spraying. an insulating film on the opposite first surface. It may further include an insulating film formed on a second surface substantially perpendicular to the first surface of the flat plate portion.

Description

technical field [0001] The present invention relates to a substrate support device used in the manufacture of semiconductor devices. In particular, it relates to a metal substrate support device with a built-in heating element. Background technique [0002] In semiconductor device manufacturing, substrate support devices are arranged in semiconductor manufacturing devices during chemical vapor deposition (CVD), surface modification, and other processing steps. In addition, when the substrate supporting device is used to generate heat, the substrate supporting device having a built-in heat generating body is arranged in the semiconductor manufacturing apparatus. Such a substrate supporting device has a structure in which a flat plate made of metal or ceramics is supported by a shaft. In addition, a plasma electrode or a heating element may be arranged inside the flat panel, and connected to a control device provided outside the semiconductor manufacturing apparatus via wiri...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/687
CPCH01L21/67103H01L21/67109H01L21/68735H01L21/68785C23C16/458C23C16/46H01L21/683
Inventor 立川俊洋宫原淳一米仓一博花待年彦高原刚二口谷淳桥本大辅
Owner NHK SPRING CO LTD