Laser-bonded component and production method for same

A technology for joining parts and lasers, which is applied in laser welding equipment, manufacturing tools, chemical instruments and methods, etc., can solve the problem of no high-melting-point materials and low-melting-point materials 25 penetration, and achieve laser energy assurance and small temperature rise.

Active Publication Date: 2015-07-22
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, penetration of the high melting point material 24 and the low melting point material 25 is not substantially produced.

Method used

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  • Laser-bonded component and production method for same
  • Laser-bonded component and production method for same
  • Laser-bonded component and production method for same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0126] figure 1 It is a cross-sectional view showing the steps of the laser-bonded component and its manufacturing method according to Embodiment 1 of the present invention.

[0127] Such as figure 1 As shown in (a), the composite sheet 31 is stacked on a copper plate 34 having a thickness of 0.4 mm. A nickel layer 33 with a thickness of 0.1 mm was formed on a copper plate 32 with a thickness of 0.2 mm to form a composite sheet material 31 . The nickel layer 33 is placed on the upper side, and the composite sheet material 31 is superimposed on the desired position on the copper plate 34 . The copper plate 34 corresponds to the metal component X. As shown in FIG. The copper plate 32 corresponds to the metal member Y. As shown in FIG. The nickel layer 33 corresponds to the surface layer. Copper corresponds to the first metal material. Nickel corresponds to the second metal material. A member in which the composite sheet material 31 is stacked on the copper plate 32 corr...

Embodiment approach 2

[0139] figure 2 It is a cross-sectional view showing the steps of the laser-bonded component and its manufacturing method according to Embodiment 2 of the present invention. figure 2 (e) is an optical micrograph (halftone image displayed on a monitor) of the cross section of the laser bonding member according to Embodiment 2 including the resolidified portion. exist figure 2 in, for with figure 1 The same symbols are used for the same constituent elements, and their descriptions are omitted.

[0140] exist figure 2 in, with figure 1 The difference is that, as figure 2 As shown in (a), the composite sheet material 31 is replaced with a composite sheet material 42 which has a nickel layer 40 with a thickness of 0.05 mm under the copper sheet 32 ​​(lower surface) in addition to the copper sheet 32 ​​and the nickel layer 33 . The nickel layer 40 corresponds to the intermediate layer.

[0141] exist figure 2 The irradiation sequence of the laser light 35 in (b) and ...

Embodiment approach 3

[0145] Figure 4 It is a cross-sectional view showing the steps of the laser-bonded component and its manufacturing method according to Embodiment 3 of the present invention. Figure 4 (c) is an optical micrograph (half-tone image displayed on a monitor) of the cross section of the laser bonding member according to Embodiment 3 including the resolidified portion.

[0146] exist Figure 4 in, with figure 2 The difference is that, as Figure 4 As shown in (a), the condenser lens 36b is installed obliquely so that the laser light 35b can be irradiated obliquely, and Figure 4 In the direction of the paper surface of (a), the surface of the nickel layer 33 is scanned with a laser. As shown in figure (a), the scanning direction is the normal line Ns perpendicular to the surface containing the nickel layer 33, and the irradiation axis A of the laser beam intersecting the normal line Ns. L The direction of the face. In addition, the normal Ns and the illumination axis A inters...

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Abstract

Provided are a laser-bonded component and a production method for same that ensure sufficient bonding strength using little laser energy and which cause little increase in surrounding temperature. A nickel layer, being a surface layer, is formed having sufficient thickness on the upper surface of a copper plate that is uppermost amongst at least two superposed copper plates, a laser is irradiated from above the nickel layer, a re-solidification section formed by fusing and alloying the copper in the copper plates and the nickel in the nickel layer is formed through to inside the bottommost copper plate, and the copper plates are bonded together. The re-solidification section having high breaking strength is formed by the alloying of the nickel and the copper. As a result, the copper plates can be bonded with a small welding surface area and little laser energy.

Description

technical field [0001] The present invention relates to a laser bonding component and a manufacturing method thereof for obtaining sufficient bonding strength with less laser irradiation energy in overlapping bonding of metal plates. Background technique [0002] As a conventional laser bonding component and its manufacturing method, there is a method in which a nickel-plated film is formed on the surface of the copper plate irradiated with laser light in the superposed bonding of copper plates and copper plates, and a laser beam is irradiated to the plated film so that between them (for example, refer to Patent Document 1). Figure 6 It is a figure which shows the conventional laser bonding component and its manufacturing method described in patent document 1. [0003] Such as Figure 6 As shown, a copper plate 12 is disposed on a composite plate 11 . The composite sheet 11 is formed of a laminated body of copper and copper-molybdenum sintered body. A nickel plated film 1...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/20B23K26/244B23K26/323B23K103/12B23K26/18B23K26/21B23K26/32H01M4/02
CPCY10T428/12493B23K2203/12B23K26/203B32B7/045B23K26/246B23K26/3213B23K26/32B32B15/01B23K26/211B23K26/244B23K2101/34B23K2103/12B23K2103/18B23K2103/26B23K26/08B23K26/21B23K26/323B32B7/05
Inventor 西川幸男田中知实糸井俊树古林义玲
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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