Manufacturing method for embedded metal block of high-frequency mixed pressed circuit board
A production method and circuit board technology, which is applied in the fields of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of high cost of high-frequency boards, high heat restricting high-speed transmission of information, and inability to solve heat dissipation problems, etc., to achieve improved heat dissipation problem effect
Inactive Publication Date: 2013-06-12
JIANGMEN SUNTAK CIRCUIT TECH
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Problems solved by technology
[0003] Usually, a printed circuit board is made of high-frequency plates, which can be semi-ceramic materials, such as Rogers (ROGERS) series and TACONIC series, or polytetrafluoroethylene, although high-frequency information can be achieved, but high-power The high heat generated by the power supply restricts the high-speed transmission of information, and cannot solve the heat dissipation problem of the printed circuit board. Moreover, the cost of high-frequency boards is extremely high
Another type of printed circuit board is made by direct lamination of high-frequency board and glass fiber board. Although the material cost is reduced, the problem of heat dissipation cannot be solved.
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[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0027] Please also refer to Figure 1 to Figure 5 The method for manufacturing a metal block embedded in a high-frequency mixed-voltage circuit board provided by an embodiment of the present invention includes the following steps: pressing a high-frequency plate 10 and a glass fiber plate 12 to form a high-frequency mixed-voltage circuit board 1 , the high-frequency mixed-voltage circuit board 1 The piezoelectric circuit board 1 has a first surface 100 located on the side of the high-frequency board 10 and a second surface 120 located on the side of the glass fiber board 12 and opposite to the firs...
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The invention belongs to the field of manufacturing of a printed circuit board and provides a manufacturing method for an embedded metal block of a high-frequency mixed pressed circuit board. The manufacturing method comprises a step of pressing and combining a high-frequency panel and a glass fiber panel into the high-frequency mixed pressed circuit board, wherein the high-frequency mixed pressed circuit board is provided with a first surface located on the side of the high-frequency panel and a second surface opposite to the first surface and located on the side of the glass fiber panel. The manufacturing method for the embedded metal block of the high-frequency mixed pressed circuit board further comprises the following steps: processing a blind slot; processing a splicing sheet; embedding a metal block; pre-splicing the metal block; and pressing and combining the metal block. According to the manufacturing method, the blind slot is processed on the glass fiber panel so as to embed the metal block and the metal block is fixed in the blind slot for contacting with the high-frequency panel, so that the radiating property of the high-frequency mixed pressed circuit board is improved and the digital quick transmitting property of the high-frequency mixed pressed circuit board is ensured.
Description
technical field [0001] The invention belongs to the field of manufacturing printed circuit boards, in particular to a method for manufacturing a metal block embedded in a high-frequency mixed-voltage circuit board. Background technique [0002] With the development of information technology, the demand for high-speed information transmission continues to increase. For example, satellite communications, microwave communications, and optical fiber communications all require information to be developed at high frequencies; computer technology processing capabilities and information memory capacity increase urgently require information Transmission is developing towards high speed. However, printed circuit boards carry these high-frequency information and high-speed transmission information. The high frequency of information puts forward high-frequency performance requirements for printed circuit boards. The high-power power supply required for high-speed information transmissio...
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IPC IPC(8): H05K3/00
Inventor 李学明姜雪飞彭卫红张军杰
Owner JIANGMEN SUNTAK CIRCUIT TECH