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Printed circuit board (PCB) and processing method

A technology of PCB board and processing method, which is applied in the field of electronics, can solve the problems of high cost and achieve the effects of low cost, simple process and short processing cycle

Active Publication Date: 2013-06-12
ZHEJIANG UNIVIEW TECH CO LTD
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  • Summary
  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

However, the cost of ENIG is relatively high. In the case of high reliability requirements, it is necessary to avoid using ENIG in the BGA area (because the surface treatment of ENIG is prone to "black disk" problems, it is necessary to avoid using it on high reliability PCBs)

Method used

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  • Printed circuit board (PCB) and processing method
  • Printed circuit board (PCB) and processing method
  • Printed circuit board (PCB) and processing method

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Embodiment Construction

[0018] In order to achieve the purpose of the present invention, the present invention provides a PCB board processing method, the general concept of which is to fill the via holes of the PCB board with low-cost and easily obtained solder to improve the electrical characteristics of the via holes. In a preferred solution, the present invention injects liquid filling solder into the through holes of the PCB board during the processing of the PCB, and then cools the PCB board so that the liquid filling solder is cooled to non-liquid filling solder, Finally, solder is filled in the via holes. Further, the solder filling can be realized by the method of reflow soldering or wave soldering. The invention can effectively improve the signal quality and the flow capacity of the via hole on the PCB, thereby improving the signal quality of the circuit on the PCB and the flow capacity of the system current.

[0019] In order to make the technical solution of the present invention clearer...

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Abstract

The invention discloses a solder taphole improving signal quality and flow capacity method and a printed circuit board (PCB) manufactured by the method. In the assembly processing process of the PCB board, firstly liquid filling solder is injected into a via hole of the PCB board, and the PCB board is cooled, so that the liquid filling solder is cooled into non-liquid filling solder which is filled into the via hole. The signal quality of the via hole on the PCB board can be effectively improved, and the flow capacity of the via hole is improved, so that the signal quality of the circuit on the PCB board and the flow capacity of system current are improved.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a PCB board and a processing method. Background technique [0002] With the rapid development of PCB interconnection technology, it drives the rapid upgrading of 3C (computer, communication, consumer electronics) products, and the signal rate on PCB also increases exponentially, quickly entering high-speed signals above 10G. More than ten years ago, the clock frequency was only 10Mhz, but now, the clock frequency of 100Mhz is very common. Those interconnecting lines, vias, and products or systems that are no longer transparent to signals. On the other hand, chips are also developing in the direction of low voltage and high power consumption. For example, the first generation of DDR memory is 2.5v, but now DDR3 has been reduced to 1.5v, which means that even if the power consumption remains unchanged, the current of the chip will continue to increase. All of these make the s...

Claims

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Application Information

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IPC IPC(8): H05K3/42
Inventor 叶飞袁杰陈欢洋
Owner ZHEJIANG UNIVIEW TECH CO LTD
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