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Adhesive sheet and electronic device

A technology of adhesive sheet and adhesive layer, applied in the direction of circuits, adhesives, electrical components, etc., can solve the problems of reduced performance of adhesive films, degradation of organic EL elements, degradation of adhesive layers, etc., and achieve good gas barrier effect

Active Publication Date: 2013-06-12
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the adhesive layer of Patent Document 2 is difficult to resist high temperature, ultraviolet light, etc., and the organic EL element or device is exposed to high temperature or ultraviolet radiation due to long-term driving or driving environment, and the resin itself of the adhesive layer may deteriorate, and the adhesive layer may deteriorate. The performance degradation of the junction film and the deterioration of the organic EL device accompanying it

Method used

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  • Adhesive sheet and electronic device
  • Adhesive sheet and electronic device
  • Adhesive sheet and electronic device

Examples

Experimental program
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Effect test

preparation example Construction

[0089] As a specific production method, for example, an organopolysilazane can be synthesized by reacting ammonia or a primary amine with a reaction product which is an unsubstituted or substituted halosilane represented by the following formula (9): The reaction product of a compound with a secondary amine. The secondary amines and primary amines to be used may be appropriately selected according to the structure of the target polysilazane compound.

[0090] [chemical formula 9]

[0091] R 1 4-m SiX m (9)

[0092] (In formula (9), m represents 2 or 3, X represents a halogen atom, R 1 Represents any substituent of the aforementioned Rx, Ry, Rz, Rx', Ry', and Rz'. )

[0093] In addition, in the present invention, a modified polysilazane can also be used as the polysilazane compound. Examples of modified polysilazanes include polymetallosilazanes containing metal atoms (the metal atoms can also form crosslinks), [(SiH 2 ) g (NH) h )] and [(SiH 2 ) i O] (wherein,...

Embodiment

[0222] Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited in any way by the following Examples.

[0223] Plasma ion implantation equipment used, XPS measurement equipment, film density measurement equipment using X-ray reflectivity method, bending test method, water vapor transmission rate measurement equipment and measurement conditions, water at the end of the adhesive layer The method of the vapor transmission test, the method of measuring the adhesive force, and the apparatus for measuring the visible light transmittance are as follows.

[0224] (Plasma ion implantation device)

[0225] RF power supply: manufactured by JEOL Ltd., model "RF" 56000

[0226] High-voltage pulse power supply: "PV-3-HSHV-0835" manufactured by Kurita Manufacturing Co., Ltd.

[0227] In addition, the plasma ion implantation apparatus used is an apparatus that implants ions using an external electric field...

preparation example 1）

[0282] A polysilazane compound is applied by spin coating on a polyethylene terephthalate film (manufactured by Mitsubishi Plastics Corporation, "PET38T-100", 38 μm thick, hereinafter referred to as "PET film") as a base material A, Heated at 120° C. for 1 minute to form a polysilazane layer containing perhydropolysilazane with a thickness of 60 nm on the PET film. Next, argon (Ar) was implanted with plasma ions on the surface of the perhydropolysilazane-containing layer using a plasma ion implantation apparatus to produce a "substrate with a gas barrier layer 1".

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Abstract

The invention pertains to an adhesive sheet that has a gas barrier layer and adhesive layer on at least one side of a substrate, wherein the gas barrier layer is configured from material containing at least oxygen atoms and silicon atoms; with respect to the total amount of oxygen atoms, nitrogen atoms and silicon atoms present in the surface layer of the gas barrier layer, the proportion of oxygen atoms present is 60-75%, the proportion of nitrogen atoms present is 0-10%, and the proportion of silicon atoms present is 25-35%; and the film density in the surface layer of the gas barrier layer is 2.4-4.0 g / cm3. The invention also pertains to electronic devices provided with said adhesive sheet as an electronic device component. The invention provides adhesive sheets of superior gas barrier properties, resistance to folding, and transparency, as well as electronic devices provided with said adhesive sheet as an electronic device component.

Description

technical field [0001] The present invention relates to an adhesive sheet and an electronic device including the adhesive sheet as a member for electronic devices. Background technique [0002] In recent years, organic electronics has attracted attention as a technology that can form displays, circuits, batteries, etc. on flexible plastic substrates at low temperatures close to room temperature using coating or printing processes, and various organic devices are being developed research and develop. [0003] For example, organic EL elements capable of high-intensity light emission driven by low-voltage direct current have attracted attention as light-emitting elements used in liquid crystal displays or electroluminescence (EL) displays. In these displays, in order to realize thinning, weight reduction, flexibility, etc., studies have been made on using a transparent plastic film as a substrate having electrodes. [0004] However, after the organic EL element is driven for ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J7/29
CPCC09J2203/326C09J2483/006C09J183/16C09J2421/00C09J2433/00Y10T428/2848C09J7/29H10K50/8445H10K50/844C09J7/22C08G77/62C09J9/00C09J2203/318H10K50/00C09D183/16C09J121/00C09J133/04
Inventor 上村和惠网野由美子铃木悠太小野义友中岛惠美
Owner LINTEC CORP
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