Addition reaction cured resin composition and photosemiconductor device

A curing resin, addition reaction technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problem of LED brightness reduction, and achieve the effect of good gas barrier properties, low oxygen permeability, and inhibition of brightness reduction.

Inactive Publication Date: 2016-06-01
AICA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the corrosion of the silver plated surface is promoted, the LED brightness will be reduced as a result

Method used

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  • Addition reaction cured resin composition and photosemiconductor device
  • Addition reaction cured resin composition and photosemiconductor device
  • Addition reaction cured resin composition and photosemiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0059] Next, the addition reaction curable resin composition of this invention is demonstrated in more detail through an Example and a comparative example.

[0060] 1. Manufacture of addition reaction curable resin composition

[0061] The compounding material shown in Table 1 was uniformly mixed in the compounding ratio shown in Table 1, and the addition reaction hardening type resin composition of Examples 1-4 and Comparative Examples 1-4 was manufactured. The units of numerical values ​​indicating the compounding amounts in Table 1 are parts by weight. Each compounding material in Table 1 is as follows.

[0062] [Table 1]

[0063]

[0064] A-1: Triallyl isocyanurate

[0065] A-2: Diallyl monoglycidyl isocyanurate

[0066] A-3: Monomethyl diallyl isocyanurate

[0067] B-1: both ends by M Vi The unit is terminated, the middle unit is composed of D unit, D Vi Unit composition or intermediate unit includes D unit, D Vi Unitary linear methylphenylvinyl polysiloxane wi...

test approach 15

[0093] Each addition reaction curable resin composition was hardened at 150 degreeC for 4 hours, and the test piece of thickness 2mm was produced. The elongation of the test piece was measured in accordance with JIS K6249 (Test method 15. Tensile test for uncured and cured silicone rubber). The unit of extension is %.

[0094] Oxygen permeability

[0095] Each addition reaction curable resin composition was cured at 150° C. for 4 hours to form a sheet having a thickness of 1 mm. The oxygen permeability of the sheet was measured in accordance with JISK7126-1 (Plastic-Film and Sheet-Permeability Test Method-Part 1: Pressure Difference Method).

[0096] Sulfur corrosion resistance

[0097] Each addition reaction curable resin composition was filled in the LED package (outside dimension 50x50 mm) whose bottom was plated with silver, and it cured at 150 degreeC for 4 hours, and it was set as the test body. Three of these test bodies were sealed in a 100 cc glass bottle prev...

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Abstract

Provided is an addition reaction cured resin composition characterized by comprising an organic cyclic compound (A) each molecule of which contains more than two functional groups reacting with SiH base through hydrosilylation reaction; a straight chain organic organopolysiloxane (B) each molecule of which contains at least two silicon bonding alkenyl reacting with the SiH base and having at least one silicon bonding aryl; organic polysiloxane (C) each molecule of which contains at least two SiH base and at least having branch chain organic polysiloxane; and a curing catalyst (D) required by addition reaction.

Description

technical field [0001] The present invention relates to an addition reaction curable resin composition and an optical semiconductor device. Background technique [0002] Conventionally, silicone resin compositions have been used as compositions for sealing optical semiconductors such as LEDs, and addition reaction-curable silicone resin compositions containing dimethylsiloxane have been widely used. Particularly recently, in order to obtain high transparency and high refractive index, phenyl-modified organopolysiloxanes have been proposed as silicone resin compositions for encapsulating optical semiconductors (Patent Document 1 to Patent Document 5). [0003] The curable silicone composition for optics of Patent Document 1 is a curable silicone composition for optics containing the following (A), (B), (C) and (D), wherein (A) has ethylene at both ends The linear organopolysiloxane composed of methyl group and phenyl group and other organic groups; (B) is composed of CH 2 =...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/05C08L83/07C08K5/3492H01L33/56
Inventor 间下琢史
Owner AICA KOGYO CO LTD
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