Waste circuit board powder-based toughening type spraying-free color regeneration composite material and preparation method

A waste circuit board, color regeneration technology, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve the problems affecting the application range of recycled composite materials, the decline of mechanical properties of waste materials, and the low surface adhesion. problem, to achieve good appearance effect, to solve the effect of difficult to handle and low cost

Active Publication Date: 2015-01-28
CHINA NAT ELECTRIC APP RES INST +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the surface can be colored by spraying, this will increase a corresponding spraying process, which will consume more manpower, material resources and time
In addition, for many recycled composite materials, due to the low surface adhesion, suitable coatings are also limited, and often cannot achieve good coloring effects
On the other hand, the mechanical properties of various waste materials added to recycled composite materials have declined, especially the impact strength has deteriorated significantly
These defects have seriously affected the application range of recycled composite materials.

Method used

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  • Waste circuit board powder-based toughening type spraying-free color regeneration composite material and preparation method
  • Waste circuit board powder-based toughening type spraying-free color regeneration composite material and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The waste circuit board powder-based toughened spray-free colored recycled composite material provided in this embodiment includes a colored surface layer and a filling layer;

[0042] 1) The colored surface layer is mainly made of the following raw materials in parts by weight:

[0043] Epoxy Color Paste 1

[0044] epoxy resin 100

[0045] Hardener 60

[0046] Curing Accelerator 0.5

[0047] Toughener 20

[0048] anti aging agent 2

[0049] 2) The filling layer is mainly made of the following raw materials in parts by weight:

[0050] epoxy resin 100

[0051]Waste printed circuit board powder 200

[0052] Hardener 60

[0053] Curing Accelerator 0.5

[0054] Toughener 20

[0055] anti aging agent 2

[0056] The epoxy resin is bisphenol A general-purpose epoxy resin E-51.

[0057] The waste circuit board powder-based toughened spray-free colored recycled composite material provided in this example is prepared by the following method:

[0058] (1) Preparation...

Embodiment 2

[0072] The waste circuit board powder-based toughened spray-free colored recycled composite material provided in this embodiment includes a colored surface layer and a filling layer;

[0073] 1) The colored surface layer is mainly made of the following raw materials in parts by weight:

[0074] Epoxy Color Paste 3

[0075] epoxy resin 100

[0076] Hardener 80

[0077] Curing Accelerator 0.5

[0078] Toughener 30

[0079] anti aging agent 2

[0080] 2) The filling layer is mainly made of the following raw materials in parts by weight:

[0081] epoxy resin 100

[0082] Waste printed circuit board powder 300

[0083] Hardener 80

[0084] Curing Accelerator 0.5

[0085] Toughener 25

[0086] anti aging agent 1

[0087] Wherein the epoxy resin is bisphenol A general-purpose epoxy resin E-51.

[0088] The waste circuit board powder-based toughened spray-free colored recycled composite material provided in this example is prepared by the following method:

[0089] (1) Pr...

Embodiment 3

[0096] The waste circuit board powder-based toughened spray-free colored recycled composite material provided in this embodiment includes a colored surface layer and a filling layer;

[0097] 1) The colored surface layer is mainly made of the following raw materials in parts by weight:

[0098] Epoxy color paste 0.5

[0099] epoxy resin 100

[0100] Hardener 60

[0101] Curing Accelerator 0.5

[0102] Toughener 20

[0103] anti aging agent 2

[0104] 2) The filling layer is mainly made of the following raw materials in parts by weight:

[0105] epoxy resin 100

[0106] Waste printed circuit board powder 100

[0107] Hardener 60

[0108] Curing Accelerator 0.5

[0109] Toughener 5

[0110] Anti-aging agent 0.5

[0111] Wherein the epoxy resin is bisphenol A general-purpose epoxy resin E44.

[0112] The waste circuit board powder-based toughened spray-free colored recycled composite material provided in this example is prepared by the following method:

[0113] (1) ...

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PUM

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Abstract

The invention relates to a waste circuit board powder-based toughening type spraying-free color regeneration composite material, which comprises a color surface layer and a filling layer, the color surface layer comprises the following raw materials by weight: 0.5-3 parts of epoxy color paste, 60-80 parts of epoxy resin 100 curing agent, 0.5 parts of curing accelerator, 5-30 parts of flexibilizer and 0.5-2 parts of age resister; and the filling layer comprises the following raw materials by weight: 100-300 parts of epoxy resin 100 waste printed circuit board powder, 60-80 parts of curing agent, 0.5 parts of curing accelerator, 5-30 parts of flexibilizer and 0.5-2 parts of age resister. The material has the following advantages of reasonable formula, low cost, excellent mechanical property (especially impact resistance strength), thereby the problems that a regeneration material in the prior art is difficult to be colored, most material only can be prepared to black or grey products with uncomfortable feeling and limited application scope can be solved. The invention also discloses a preparation method of the above material, and the method has the advantages of simple technology and convenient operation.

Description

technical field [0001] The invention belongs to the technical field of recycled composite materials, and in particular relates to a waste circuit board powder-based toughened spray-free colored recycled composite material and a preparation method thereof. Background technique [0002] Printed circuit board is the foundation of the electronic and electrical industry, one of the core components of electronic and electrical products, covering almost all electronic and electrical products. In my country, the weight of scraps produced by circuit board manufacturers alone reaches more than 400,000 tons every year. Considering the large amount of waste electrical appliances imported each year and the waste circuit boards produced by the dismantling of scrapped electronic products in mainland China, the total amount Will reach more than 1 million tons. Therefore, environmentally friendly and reliable recycling of waste circuit boards can save resources on the one hand and reduce env...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/06B32B27/18B32B27/38C08L63/00C08L63/02C08K13/04C08K7/14B29C69/00
Inventor 曹诺符永高赵新丁磊王玲胡嘉琦邓梅玲万超杜彬王鹏程何丽娇
Owner CHINA NAT ELECTRIC APP RES INST
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