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Characterization method of hard brittle high-precision component sub-surface damage degree

A technology of subsurface damage and hard brittleness, which is applied in the field of characterization of subsurface damage after grinding, polishing and corrosion of hard and brittle high-precision components. The exact depth of subsurface damage layer and the limited prediction accuracy of subsurface damage microcrack depth

Active Publication Date: 2013-06-19
XI AN JIAOTONG UNIV
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Problems solved by technology

The disadvantage of this research method is that the magnetorheological polishing method can only roughly estimate the maximum depth of subsurface damage, and cannot accurately detect the exact depth of each microcrack in the subsurface damage layer.
However, the ratio model takes the abrasive load as an independent variable. Due to the complexity and randomness of the grinding and grinding process, the prediction accuracy of the model for the depth of micro-cracks in subsurface damage is limited, and it cannot be quickly and accurately estimated the depth of micro-cracks in subsurface damage. Accurate detection

Method used

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  • Characterization method of hard brittle high-precision component sub-surface damage degree
  • Characterization method of hard brittle high-precision component sub-surface damage degree
  • Characterization method of hard brittle high-precision component sub-surface damage degree

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Embodiment Construction

[0025] refer to figure 2 , image 3 First, sputter 100nm thick Cr on a Φ50×2mm K9 glass substrate using a magnetron sputtering machine, use photoresist AZ to uniformly coat the sputtered Cr layer, and use a mask with 2×2mm square holes The film plate is photolithographically etched on the surface of the K9 glass substrate after uniform glue, and then the sample is developed in a 5‰ NaOH solution for 5 minutes, and the film is hardened in a dryer at 95°C for 3 hours, and the square hole is etched with cerium ammonium nitrate Cr in about 50 seconds, made into a 2 × 2mm square patterned substrate with a Cr masking layer ( figure 2 ). Use a step profiler to detect the depth of the masking layer square pattern and record the data. Put the substrate of the Cr mask into the BOE solution (buffer solution of hydrofluoric acid), etch it in a water bath with a constant temperature of 25°C, and then use a step profiler to detect the depth of the square pattern on the unmasked part of...

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Abstract

The invention discloses a characterization method of a hard brittle high-precision component sub-surface damage degree. The characterization method of the hard brittle high-precision component sub-surface damage degree is characterized in that two samples are used for corrosion testing, the lengthways removal rate of a polishing settled layer is obtained through a first sample, and corrosion time and thickness can be precisely obtained from corrosion of a second sample, micro-crack of the sub-surface of the second block is exposed out completely, and finally a con-focal microscope is used for conducting quick and precise observation and computing to damage of the sub-surface of the second sample. A characterization parameter of the micro-crack of the sub-surface of a high-precision component is established.

Description

technical field [0001] The invention relates to a detection of subsurface damage of high-precision optical elements, in particular to a method for characterizing the degree of subsurface damage of hard and brittle high-precision components after grinding, polishing and corrosion, so as to facilitate the detection and elimination of the damage and improve the quality of the material. performance and service life. Background technique [0002] The application of hard and brittle high-precision components, such as optical glass, engineering ceramics, and silicon crystals, mainly involves high-end fields such as energy, space, defense equipment, integrated circuits, and MEMS. Therefore, it is necessary to ensure the processing quality to the greatest extent during the processing. The processing of hard and brittle high-precision components is generally divided into three stages: grinding, grinding and polishing. In the process of grinding and grinding, the material removal mecha...

Claims

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Application Information

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IPC IPC(8): G01N21/95
Inventor 王海容张碧珂肖利辉苑国英
Owner XI AN JIAOTONG UNIV
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