Small-sized and multifunctional MINI CPU module specification

A multi-functional, small-sized technology, applied in the multi-functional MINI CPU module specification, small-sized field, can solve the problem of not supporting dual GigaLAN, and achieve the effects of saving research and development time and cost, improving reliability, and powerful processing performance

Inactive Publication Date: 2013-06-19
北京盛博协同科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

COM Express is quite flexible in type, it has 4 optional sizes, three of which are 110×55 mm, 125×95 mm, 95×55 mm, the size is larger, and the other size is smaller (8...

Method used

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  • Small-sized and multifunctional MINI CPU module specification
  • Small-sized and multifunctional MINI CPU module specification
  • Small-sized and multifunctional MINI CPU module specification

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Embodiment Construction

[0015] The present invention will be further described below in conjunction with embodiment:

[0016] A kind of small-sized, multifunctional MINI CPU module specification described in this embodiment is a CPU module specification designed to meet future processor development direction and high-speed bus and interface technical requirements, specifically marked as follows:

[0017] 1. See the table below for the definition of bus pins

[0018]

[0019]

[0020]

[0021] 2. Signal description

[0022] 2.1 VIDEO signal

[0023] VIDEO_CVBS:

[0024] Analog signal output: output composite video signal or output blue signal for RGB video;

[0025] VIDEO_Y:

[0026] Analog signal output: output Y signal (brightness signal) to S video terminal, or output red signal (SCART) to RGB video;

[0027] VIDEO_C:

[0028] Analog signal output: output C signal (color / chroma signal) for S video terminal, or output green signal for RGB video;

[0029] 2.2 VGA signal

[0030] VGA ...

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Abstract

The invention discloses a small-sized and multifunctional MINI CPU module specification. A bus pin definition and signal description of the small-sized and multifunctional MINI CPU module specification comprise a Video analog video signal, a VGA display signal, an HD Audio signal, an LVDS signal, an SATA signal, a USB 2.0 signal, a USB 3.0 signal, a PCI-e Bus signal, a Giga LAN signal, an SMBUS signal, a Serial signal, a GPIO signal, a DDI signal (which can be used along with the GPIO signal), an LPC Bus signal, a KB/MS/Other signal, an ATX signal, a Power standby signal, a Power signal, a GND signal and a reserved pin. A double-row surface-mounted 180 pin socket QSH-090-F-D-A-K produced by the SAMTEC company is selected as a bus connector. The size of the module is 85 * 65 mm. On the basis of the MINI CPU module specification, embedded computer modules of various performance classes can be developed, a system engineer can only focus on a design of an application system substrate, the computer system functions are changed just through redesign of the application system substrate, the computer system functions can be updated just through the utilization of latest computer modules, and developing time and cost are greatly saved.

Description

technical field [0001] The invention relates to an embedded computer module specification, in particular to a small size, multifunctional MINI CPU module specification. Background technique [0002] Common small-size embedded computer-on-module specifications include ETXexpress, COM Express, and so on. ETX has successfully solved some bottlenecks in the practical application of PC / 104, which was previously monopolized in the field of embedded computers, such as the cable-free design of the entire board, relatively higher computing performance, more abundant expansion interfaces, and good thermal performance. Design concepts and higher integration, etc., created the "chip PC era". But ETXexpress does not support Giga LAN, SATA signal, USB3.0 signal, PCI express signal technology, and the size is relatively large (114×95 mm). COM Express is designed to adapt to future technological development trends and market demands, incorporating emerging bus and interface technologies s...

Claims

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Application Information

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IPC IPC(8): G06F15/76
Inventor 何畏
Owner 北京盛博协同科技有限责任公司
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