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Semiconductor processing device

A technology for processing equipment and semiconductors, applied in semiconductor/solid-state device manufacturing, liquid cleaning methods, electrical components, etc., can solve the problems of large equipment volume, affecting production throughput, high consumption of processing liquid and ultrapure water, etc. Reach the effect of reducing waste water discharge, convenient connection and reducing consumption

Active Publication Date: 2013-07-03
WUXI HUAYING MICROELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing equipment for preparing ultra-clean wafer surfaces generally has the following disadvantages: 1. The equipment is large in size; 2. The consumption of processing liquid and ultrapure water is relatively high; 3. Once some equipment fails, it must be eliminated Often affects production throughput

Method used

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  • Semiconductor processing device
  • Semiconductor processing device
  • Semiconductor processing device

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Embodiment Construction

[0027] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0028] The term "one embodiment" or "embodiment" here refers to that specific features, structures or characteristics related to the embodiment can be included in at least one implementation of the present invention. The appearances of "in one embodiment" in various places in this specification do not necessarily all refer to the same embodiment, nor do they necessarily refer to a separate or selected embodiment that is mutually exclusive of other embodiments. "Multiple" and "several" in the present invention mean two or more. "And / or" in the present invention means "and" or "or".

[0029] figure 1 A schematic structural view of the modularized semiconductor processing equipment 1 in the present invention is shown. Such as fig...

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Abstract

The invention discloses a semiconductor processing device which comprises a semiconductor processing module and a fluid transfer module. The fluid transfer module comprises a support frame, a plurality of base plates, various valves, a pump, a meter, a transducer, connectors and pipelines, wherein the base plates are assembled on the support frame and form a fluid space, the various valves, the pump, the meter, the transducer, the connectors and the pipelines are used for transferring fluid, at least one base plate is provided with mounting holes, and each valve is provided with an end portion which is communicated with an end port, penetrates through the base plates and extends into the fluid space. The fluid transfer module has the advantages of being simple in structure, convenient to flexible to assemble and easy to maintain. Further, assemblies can be changed conveniently and the like.

Description

【Technical field】 [0001] The invention relates to the field of semiconductor surface treatment, in particular to a semiconductor processing equipment for surface treatment of semiconductor wafers. 【Background technique】 [0002] At present, integrated circuits are gradually being applied to many fields, such as computers, communications, industrial control and consumer electronics. The manufacturing of integrated circuits has become a basic industry as important as steel. [0003] Wafers are the carriers used to produce integrated circuits. In actual production, the wafers that need to be prepared have a flat, ultra-clean surface, and the existing methods for preparing ultra-clean wafer surfaces can be divided into two categories: wet processes such as immersion and spray techniques, and processes such as Dry treatment process based on chemical vapor and plasma technology. Among them, the wet processing process is a relatively widely used method in the prior art. The wet ...

Claims

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Application Information

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IPC IPC(8): H01L21/02B08B3/04
Inventor 马彦圣温子瑛
Owner WUXI HUAYING MICROELECTRONICS TECH CO LTD
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