Multi-line silicon wafer cutting method

Abstract

The invention provides a multi-line silicon wafer cutting method which includes the steps of firstly setting at least one silicon block to be cut above a steel cutting line, allowing an entry side of each silicon block to incline towards the steel cutting line to guarantee an acute included angle between the entry side and the steel cutting line, and allowing the entry side to contact with the steel cutting line firstly at a downstream ridge part of the steel cutting line in the walking direction; and secondly, allowing the steel cutting line to cut the silicon blocks. The multi-line silicon wafer cutting method has the advantages that entry cutting is unaffected while the adverse effect on entry cutting of the silicon blocks is reduced, and quality in cutting the silicon blocks is higher.

Description

technical field [0001] The invention relates to the technical field of semiconductor material processing, in particular to a method for multi-wire cutting of silicon wafers. Background technique [0002] In the solar energy industry, cutting silicon blocks to obtain qualified silicon wafers is a key link in the entire industrial chain. [0003] At present, the main method of cutting silicon blocks into silicon wafers in the industry is to use the multi-wire cutting equipment HCT-E500SD-B / 5 for multi-wire cutting. The multi-wire cutting methods mainly include single cutting and reciprocating cutting, among which single cutting is the mainstream cutting method. In the process of single cutting, the cutting steel wire 01 is first set on a plurality of guide wheels 02. During the rotation of the guide wheels 02, the cutting steel wire 01 runs at high speed on the guide wheels 02 to form a cutting edge. The traditional The way of cutting in is to lower the multiple silicon bloc...

AI Technical Summary

Problems solved by technology

However, since the two inclination angles are in opposite directions, there will be an inclination angle of the entry surface of the silicon block 03 that is oppositely inclined to the moving direction of the cutting steel wire 01, so that when the cutting steel wire 01 moves, the entry surface of the silicon block 03 The inclination angle of the knife face and the cutting steel wire 01 enter the knife in the opposite direction. In this case, it is easy to cause a gap on the knife entry surface of the silicon block 03, and this cutting method has restrictions on the traditional process parameter setting, so the parameters cannot be flexibly adjusted. optimize

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