Multi-line silicon wafer cutting method

A multi-wire cutting, silicon wafer technology, applied in fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of parameter optimization, constraints, gaps, etc., to improve the cutting quality and reduce the adverse effects of cutting. Effect

Active Publication Date: 2013-07-10
TIANJIN YINGLI NEW ENERGY RESOURCES
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Problems solved by technology

However, since the two inclination angles are in opposite directions, there will be an inclination angle of the entry surface of the silicon block 03 that is oppositely inclined to the moving direction of the cutting steel wire 01, so that when the cutting steel wire 01 moves, the entry surface of the silicon block 03 The inclinati

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  • Multi-line silicon wafer cutting method

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[0026] The invention provides a magnesium oxide protective film evaporation device for a plasma display screen, which realizes that the heights of each support block on a support carrier are consistent, thereby reducing the probability of breaking the glass substrate during the evaporation process and reducing the plasma plate The reject rate of the display.

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0028] Such as Figure 4-Figure 7 As shown, the method for multi-line cutting o...

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Abstract

The invention provides a multi-line silicon wafer cutting method which includes the steps of firstly setting at least one silicon block to be cut above a steel cutting line, allowing an entry side of each silicon block to incline towards the steel cutting line to guarantee an acute included angle between the entry side and the steel cutting line, and allowing the entry side to contact with the steel cutting line firstly at a downstream ridge part of the steel cutting line in the walking direction; and secondly, allowing the steel cutting line to cut the silicon blocks. The multi-line silicon wafer cutting method has the advantages that entry cutting is unaffected while the adverse effect on entry cutting of the silicon blocks is reduced, and quality in cutting the silicon blocks is higher.

Description

technical field [0001] The invention relates to the technical field of semiconductor material processing, in particular to a method for multi-wire cutting of silicon wafers. Background technique [0002] In the solar energy industry, cutting silicon blocks to obtain qualified silicon wafers is a key link in the entire industrial chain. [0003] At present, the main method of cutting silicon blocks into silicon wafers in the industry is to use the multi-wire cutting equipment HCT-E500SD-B / 5 for multi-wire cutting. The multi-wire cutting methods mainly include single cutting and reciprocating cutting, among which single cutting is the mainstream cutting method. In the process of single cutting, the cutting steel wire 01 is first set on a plurality of guide wheels 02. During the rotation of the guide wheels 02, the cutting steel wire 01 runs at high speed on the guide wheels 02 to form a cutting edge. The traditional The way of cutting in is to lower the multiple silicon bloc...

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Application Information

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IPC IPC(8): B28D5/04
Inventor 王鑫波王康张凯付海洋王世明
Owner TIANJIN YINGLI NEW ENERGY RESOURCES
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