Test method of residual stress of bridge film structure of micro electro mechanical system

Abstract

The invention discloses a test method of residual stress of a bridge film structure of a micro electro mechanical system. The test method comprises step 1, forming a load displacement curve of the bridge film structure of the micro electro mechanical system, obtaining an actual measurement elastic coefficient through the load displacement curve, forming a load displacement curve which is free of the residual stress and obtaining a simulation elastic coefficient which is free of the residual stress through the load displacement curve which is free of the residual stress; step 2, determining a residual stress state of the bridge film structure of the micro electro mechanical system; step 3, obtaining a simulation elastic coefficient with the residual stress through a simulation load displacement curve with the residual stress; and step 4, changing the size of initial residual stress of the bridge film structure of the micro electro mechanical system until that the simulation elastic coefficient with the residual stress is equal to the actual measurement elastic coefficient to enable the size of the initial residual stress at the moment to be the size of the residual stress which is contained in the bridge film structure of the micro electro mechanical system. The test method of the residual stress of the bridge film structure of the micro electro mechanical system has the advantage of being capable of simply testing residual stress of multiple bridge film structures.

Description

technical field [0001] The invention relates to the field of testing, in particular to a method for testing the residual stress of a microelectromechanical system bridge membrane structure. Background technique [0002] MEMS combines microelectronics technology with micromachining technology and other technological means, involving physics, chemistry, biology, microelectronics, mechanical manufacturing and design, materials and other disciplines, and is a cutting-edge technology that intersects multiple disciplines. Micro-electro-mechanical systems are small in size, light in weight, and can be mass-produced. They have irreplaceable advantages in military and civilian fields such as aerospace, aviation, ships, and electronics, and their applications are becoming more and more extensive. [0003] MEMS bridge membrane structures are widely used in MEMS relays, MEMS switches, MEMS variable capacitors and other devices. [0004] Thin films in MEMS bridge membrane structures are...

AI Technical Summary

Problems solved by technology

The disc bending method needs to prepare a disc for bending test, which mainly reflects the residual stress of the film as a whole, and is difficult to apply to mechanical structures with complex shapes.

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