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Radiation heat dissipation coating for reducing light-emitting diode (LED) chip junction temperature and preparation method thereof

An LED chip, radiation heat dissipation technology, applied in the field of optical coatings, can solve the problems of low gloss, insignificant cooling range, complicated construction, etc. The effect of vibratory activity

Inactive Publication Date: 2013-07-24
SHANGHAI SANSI ELECTRONICS ENG +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most of the infrared radiation heat dissipation coatings used in the market can only reduce the temperature on the surface of the radiator, such as the high thermal conductivity coating disclosed in patent CN201110253676.8, and its color is monotonous, the decoration is poor, the emissivity is low, and its use is limited.
Another example is the heat-dissipating coating disclosed in patent CN201110031374.6. Although it has a thermal conductivity of 5w / m3·k and a far-infrared emissivity of 0.8, its cooling range is limited in the middle and low temperature ranges. The junction temperature of the LED chip does not drop significantly, which cannot solve the problem of the junction temperature of the LED chip.
Moreover, the common radiation heat dissipation coatings currently on the market are complicated to construct and have low gloss.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] First weigh 20% of epoxy resin, 10% of amino resin, 12% of butyl acetate, 5% of n-butanol, 5% of xylene, 30% of far-infrared ceramic powder, 12% of silicon carbide, and 3% of cerium oxide. Each component is mixed and stirred, and the stirring speed is 2000r / min. While stirring, add 0.5% of HX-3200 leveling agent, 0.3% of HX-4021 dispersant, 1.5% of HX-301 anti-settling agent, and 0.7% of EFKA-2021 defoamer. Then adjust the stirring speed to 3500r / min, after stirring for 45min, grind in the grinder for 2 hours, the grinding speed is 3000r / min. Then, the stirring time in the mixer is 30min, and the stirring speed is 2000r / min. Finally, adjust the appropriate viscosity, filter with a 300-mesh filter, and pack.

[0021] Test results: when the LED chip junction temperature is 70-90°C, the chip junction temperature measured by spraying the radiation heat dissipation coating of the present invention on the radiator of the LED lamp is lower than that of the chip without spray...

Embodiment 2

[0023] First weigh 30% of epoxy resin, 10% of amino resin, 12% of butyl acetate, 4% of n-butanol, 4% of xylene, 25% of far-infrared ceramic powder, 9% of silicon carbide, and 3% of cerium oxide. Each component is mixed and stirred, and the stirring speed is 2000r / min. While stirring, add 0.5% of HX-3200 leveling agent, 0.6% of HX-4021 dispersant, 1.2% of HX-301 anti-settling agent, and 0.7% of EFKA-2021 defoamer. Then adjust the stirring speed to 3500r / min, after stirring for 45min, grind in the grinder for 2 hours, the grinding speed is 3000r / min. Then, the stirring time in the mixer is 30min, and the stirring speed is 2000r / min. Finally, adjust the appropriate viscosity, filter with a 300-mesh filter, and pack.

[0024] Test results: when the LED chip junction temperature is 70-90°C, the chip junction temperature measured by spraying the radiation heat dissipation coating of the present invention on the radiator of the LED lamp is lower than that of the chip without sprayi...

Embodiment 3

[0026] First weigh 40% of epoxy resin, 14% of amino resin, 9% of butyl acetate, 3% of n-butanol, 20% of far-infrared ceramic powder, 10% of silicon carbide, and 1% of cerium oxide, and mix and stir the above components , the stirring speed is 2000r / min. While stirring, add 0.5% of HX-3200 leveling agent, 0.5% of HX-4021 dispersant, 1.5% of HX-301 anti-settling agent, and 0.5% of EFKA-2021 defoamer. Then adjust the stirring speed to 3500r / min, after stirring for 45min, grind in the grinder for 2 hours, the grinding speed is 3000r / min. Then, the stirring time in the mixer is 30min, and the stirring speed is 2000r / min. Finally, adjust the appropriate viscosity, filter with a 300-mesh filter, and pack.

[0027] Test results: when the LED chip junction temperature is 70-90°C, the chip junction temperature measured by spraying the radiation heat dissipation coating of the present invention on the radiator of the LED lamp is lower than that of the chip without spraying the radiatio...

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Abstract

The invention discloses a radiation heat dissipation coating for reducing the light-emitting diode (LED) chip junction temperature and a preparation method thereof. The coating comprise the following components in percentage by weight: 30-70% of macromolecular resin, 5-40% of solvent, 10-30% of far infrared ceramic powder, 5-20% of silicon carbide, 0.5-3% of cerium oxide and 1-5% of addition agent. By utilizing the radiation heat dissipation coating disclosed by the invention, the LED chip junction temperature can be greatly lowered, and the service life of an LED chip in a lamp can be prolonged.

Description

technical field [0001] The invention relates to an optical paint, and further relates to a radiation heat dissipation paint capable of reducing the junction temperature of an LED chip. Background technique [0002] Most of the infrared radiation heat dissipation coatings currently used in the market can only reduce the temperature on the surface of the radiator, such as the high thermal conductivity coating disclosed in patent CN201110253676.8, and its color is monotonous, poor in decoration, low in emissivity, and limited in use. Another example is the heat-dissipating coating disclosed in patent CN201110031374.6. Although it has a thermal conductivity of 5w / m3·k and a far-infrared emissivity of 0.8, its cooling range is limited in the middle and low temperature ranges. The temperature drop of the junction temperature of the LED chip is not obvious, which cannot solve the problem of the junction temperature of the LED chip. Moreover, the common radiation heat-dissipating c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/00C09D133/00C09D175/04C09D183/04C09D7/12
Inventor 陈春根许礼李晟何孝亮
Owner SHANGHAI SANSI ELECTRONICS ENG
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