A kind of acidic cyanide-free copper-tin alloy electroplating solution

A copper-tin alloy and electroplating solution technology, applied in the field of surface treatment, can solve the problems of long-term fogging of electroplating, narrow operating range, low current efficiency, etc., and achieve the effects of uniform and bright appearance, wide current density range, and improved current efficiency.

Active Publication Date: 2016-03-23
江门市瑞期精细化学工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The newly emerging copper-tin alloy of pyrophosphate system that can replace the cyanide system is unable to completely replace the cyanide process for the time being due to its low current efficiency and high cost, which affect its added value, and its narrow operating range and long-term plating exposure.

Method used

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  • A kind of acidic cyanide-free copper-tin alloy electroplating solution

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Experimental program
Comparison scheme
Effect test

Embodiment １

[0029] An acidic cyanide-free copper-tin alloy electroplating solution with the following formula:

[0030] Hydrochloric acid 50g / L

[0031] Copper chloride 10g / L

[0032] Stannous chloride 10g / L

[0033] OP-92.5g / L

[0034] P-Chlorobenzaldehyde 0.5g / L

[0035] Preparation method: Dissolve copper chloride and stannous chloride in an aqueous hydrochloric acid solution, add dispersant and gloss agent under stirring, stir until completely dissolved, and add water to a constant volume.

[0036] Electroplating operation: the cathode is a copper sheet, the anode is a phosphor copper plate, the pH is less than 1, and the current density is 1A / dm 2 , The temperature is 30 ℃, after 2 minutes of electroplating, a uniform and bright copper-tin alloy is plated on the copper sheet, the thickness is 1μm, and the hardness is 380HV. The appearance of the coating is bright, and the coating is baked at 120°C for 60 minutes without blistering.

Embodiment 2

[0038] An acidic cyanide-free copper-tin alloy electroplating solution with the following formula:

[0039] Hydrochloric acid 75g / L

[0040] Copper chloride 20g / L

[0041] Stannous chloride 20g / L

[0042] OP-105g / L

[0043] P-Chlorobenzaldehyde 0.5g / L

[0044] See Example 1 for the preparation method.

[0045] Electroplating operation: the cathode is a copper sheet, the anode is a phosphor copper plate, the pH is less than 1, and the current density is 0.5A / dm 2 , The temperature is 40 ℃, after 5 minutes of electroplating, a uniform and bright copper-tin alloy is plated on the copper sheet, the thickness is 3μm, and the hardness is 380HV. The appearance of the coating is bright, and the coating is baked at 120°C for 60 minutes without blistering.

Embodiment 3

[0047] An acidic cyanide-free copper-tin alloy electroplating solution with the following formula:

[0048] Hydrochloric acid 100g / L

[0049] Copper chloride 15g / L

[0050] Stannous chloride 15g / L

[0051] O-205g / L

[0052] Piperonal 0.5g / L

[0053] See Example 1 for the preparation method.

[0054] Electroplating operation: the cathode is a copper sheet, the anode is a phosphor copper plate, the pH is less than 1, and the current density is 2A / dm 2 , The temperature is 20 ℃, after electroplating for 10 minutes, the copper sheet is plated with a uniform and bright copper-tin alloy with a thickness of 5μm and a hardness of 380HV. The appearance of the coating is bright, and the coating is baked at 120°C for 60 minutes without blistering.

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Abstract

The invention discloses an acidic cyanide-free copper-tin alloy electroplating solution. The electroplating solution is an acidic system, using inorganic salt as the main salt, and adding a dispersant and a gloss agent. This system can effectively improve the current efficiency of the process, thereby increasing the deposition rate of the coating, and overcoming the basic cyanide-free copper-tin alloy. The disadvantage of thin coating. The electroplating solution of the invention has the advantages of simple operation, low cost, wide range of current density, uniform and bright appearance of the obtained coating, good bonding force and good corrosion resistance. The electroplating solution of the present invention is cyanide-free and lead-free, and has no other heavy metal additives and organic complexing agents, is safe and environment-friendly, effectively avoids its harm to the ecological environment, and effectively reduces waste water treatment cost.

Description

technical field [0001] The invention belongs to the technical field of surface treatment, in particular to a cyanide-free copper-tin alloy electroplating solution. Background technique [0002] Some people have allergic reactions to nickel, which can cause dermatitis or macular rash after exposure. Therefore, in recent years, Europe and the United States have restricted nickel products, such as sanitary ware and lighting. Therefore, developing new nickel-free or nickel-substituted products has become a new research direction in the industry. The traditional nickel substitution process includes cyanide system and pyrophosphate system. Cyanide system copper-tin alloy is an old technology with a mature formula, but it is highly toxic and will cause great damage to the health of on-site operators. At the same time, the exhaust gas and sewage discharged are not conducive to environmental protection. Therefore, the country promulgated the "Clean Production Promotion Law" and th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/56
Inventor 洪条民
Owner 江门市瑞期精细化学工程有限公司
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