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Synchronous path optimization method in laser cutting process

A technology of synchronous path and laser cutting, which is applied in the direction of laser welding equipment, electrical program control, digital control, etc., can solve the problem of time-consuming waiting for path optimization, and achieve the effect of reducing empty travel and good technical effect

Active Publication Date: 2017-05-03
KUNSHAN THETA MICRO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is the problem of time-consuming waiting for path optimization during laser cutting in the existing laser cutting SMT stencil process

Method used

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  • Synchronous path optimization method in laser cutting process
  • Synchronous path optimization method in laser cutting process
  • Synchronous path optimization method in laser cutting process

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A method for laser cutting SMT screen, comprising the following steps:

[0028] Ⅰ) Layer the SMT screen, the layering strategy is to divide the SMT screen into N layers according to the threshold n of the area ratio of the opening and the threshold m of the aspect ratio, where N is equal to 3; for each opening according to its area Ratio and aspect ratio, calculate the layer it is in;

[0029] Ⅱ) Path optimization, according to the order of layers, according to the principle of cutting small openings first and then cutting large openings and reducing the idle travel of the laser head when cutting SMT stencils, optimize the path of each layer respectively; path optimization adopts band limitation The greedy algorithm, set the distance threshold x (reject the opening that is too close to the current opening during the search process to avoid the thermal effect deformation generated during the cutting process that will adversely affect the next opening to be cut), select t...

Embodiment 2

[0033] The synchronous path optimization method in the laser cutting process is divided into four steps: layering the cutting file, optimizing the path of each layer opening, opening the path optimization thread during cutting, and completing the cutting.

[0034] The first step: layering, the layering strategy is divided according to n (the threshold of the area ratio of the opening) and m (the threshold of the aspect ratio): one layer, two layers, three layers, and four layers; for each opening according to its area Ratio and aspect ratio calculate the layer it is in, such as figure 1 The openings a, b, and c shown are divided into the first floor, d, e are divided into the second floor, f, g are divided into the third floor, and h is divided into the fourth floor.

[0035] Step 2: Path optimization Optimize each layer in the order of the first layer, second layer, third layer, and fourth layer, which can not only ensure that small openings are cut first, but also cut after ...

Embodiment 3

[0039]A method for laser cutting an SMT screen, comprising the following steps: 1) SMT screens are layered, and the layering strategy is to divide the SMT screens into N layers, where N is equal to 5; for each opening, calculate the layer it is in according to its area ratio and width-thickness ratio; Ⅱ) path optimization, according to the order of layers, according to the order of the layers, cut the small opening first and then cut and reduce Based on the principle of the empty travel of the laser head when cutting SMT stencils, path optimization is performed on each layer; the path optimization adopts a limited greedy algorithm, and the distance threshold x is set (the openings that are too close to the current opening are eliminated during the search process) To avoid the thermal effect deformation generated during the cutting process that will adversely affect the next opening to be cut), select the starting point, and then calculate the distance D between the remaining op...

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Abstract

The invention relates to a synchronization path optimization method in a laser cutting process and mainly aims at solving the problems of time consumption and waiting in path optimization at laser cutting time in the process that laser cuts an SMT net plate in the prior art. The synchronization path optimization method comprises the flowing steps: layering the SMT net plate; optimizing the path, and respectively conducting path optimization on each layer according to the layering sequence and according to the principles that small openings are cut first and then large openings are cut and empty-going strokes are reduced when a laser head cuts the SMT net plate; opening an path optimization thread in the cutting process, opening a thread in an upper computer to conduct path optimization calculation at intervals of execution of cutting the thread, calculating next opening to be cut, an forming a cutting path; and cutting the SMT net plate along the cutting path. The synchronization path optimization method well solves the problems and is used in the laser micro-processing industry.

Description

technical field [0001] The invention relates to a synchronous path optimization method in the laser cutting process, in particular to a layered path optimization method for reducing idle strokes in the laser cutting process of SMT screen plates. Background technique [0002] The laser cutting machine adopts the mode of upper computer and lower computer, and the upper computer sends the processed data to the lower computer for execution. During the cutting process, the lower computer is running, while the upper computer is in a waiting state; wait until the current opening is cut, and then continue to send the next piece of cutting data. The cutting process is generally long, and the host computer is idle most of the time during this process. Doing path optimization before cutting adds time to the overall cutting process. [0003] The invention proposes a synchronous path optimization method in the cutting process, which uses the idle time of the upper computer during the c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/19B23K26/38
Inventor 魏志凌宁军冯顾问李哲峰
Owner KUNSHAN THETA MICRO
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