Plasma etcher loading system

Abstract

A plasma etcher loading system comprises a loading cavity body and a cavity cover, a sealing ring is arranged between the loading cavity body and the cavity cover, a manipulator sheet taking and sending opening is formed in one side of the loading cavity body, a gate valve is arranged in the sheet taking and sending opening and connected with a manipulator cavity body, the loading cavity body is connected with a vacuum mechanical pump and an external air source, a tray rack of a supporting sheet tray is arranged inside the loading cavity body, the tray rack is provided with a plurality of supporting positions of the supporting sheet tray, each supporting position is provided with a notch which allows the sheet tray to leave, the tray rack is fixed on a base frame which is connected with a lifting rotating device, the lifting rotating device comprises a lifting operation portion and a rotating operation portion, the lifting operation portion comprises a guide rod, a lifting motor and a lifting transmission mechanism, the rotating operation portion comprises a rotating motor and a rotating transmission mechanism which is used for connecting the guide rod with the rotating motor, and a gap between the guide rod and the cavity body is sealed. The plasma etcher loading system has the advantages of being large in productivity of the sheet tray and capable of achieving batch machining.

Description

technical field [0001] The invention relates to the field of plasma etching machines, in particular to a loading system of a plasma etching machine. Background technique [0002] Plasma etching is the most common form of dry etching. Its principle is that the gas exposed to the electron area forms a plasma, and the resulting ionized gas and gas composed of released high-energy electrons form a plasma or ion , when the ionized gas atoms are accelerated through an electric field, they release enough force with surface repelling forces to tightly bond materials or etch surfaces. [0003] Etching is an important process in the manufacturing process of semiconductors, microelectronics and LEDs. Etching is the process of selectively removing unnecessary materials from the surface of silicon wafers or sapphire substrates by chemical or physical methods. With the integration of semiconductor devices With the improvement of precision, the line width of semiconductor devices is getti...

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the shortcomings of the existing plasma etching machine loading system, which has a small disk throughput and cannot realize batch processing, the present invention provides a plasma etching machine with a large disk throughput and capable of batch processing. system

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