Plasma etcher loading system

A plasma and loading system technology, applied in the direction of discharge tubes, electrical components, circuits, etc., can solve the problems of inability to realize batch processing and small disk throughput, and meet the needs of large-scale industrial production, high production efficiency, and automation high degree of effect

Inactive Publication Date: 2013-07-24
TDG MACHINERY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the shortcomings of the existing plasma etching machine loading system, which has a small disk throughput and cannot rea

Method used

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  • Plasma etcher loading system
  • Plasma etcher loading system

Examples

Experimental program
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Embodiment Construction

[0022] The loading system of the plasma etching machine includes a loading chamber 1 and a chamber cover 2, a sealing ring 4 is provided between the loading chamber 1 and the chamber cover 2, and a manipulator pick-up and delivery port 8 is provided on one side of the loading chamber 1, and There is a flapper valve at the 8th place of the sheet feeding port, and the flapper valve is connected with the cavity of the manipulator; the loading cavity 1 is connected with the vacuum mechanical pump and the external air source. The loading cavity 1 is provided with a vacuum pumping channel 9 connected to a vacuum mechanical pump, an air intake channel 8 connected to an external air source, and a detection port connected to a vacuum detection device. The sealing ring 4 is installed in the sealing groove of the loading cavity.

[0023] The inside of the loading cavity 1 is provided with a tray rack 10 for supporting the discs. The tray rack 10 has a plurality of holding positions for s...

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Abstract

A plasma etcher loading system comprises a loading cavity body and a cavity cover, a sealing ring is arranged between the loading cavity body and the cavity cover, a manipulator sheet taking and sending opening is formed in one side of the loading cavity body, a gate valve is arranged in the sheet taking and sending opening and connected with a manipulator cavity body, the loading cavity body is connected with a vacuum mechanical pump and an external air source, a tray rack of a supporting sheet tray is arranged inside the loading cavity body, the tray rack is provided with a plurality of supporting positions of the supporting sheet tray, each supporting position is provided with a notch which allows the sheet tray to leave, the tray rack is fixed on a base frame which is connected with a lifting rotating device, the lifting rotating device comprises a lifting operation portion and a rotating operation portion, the lifting operation portion comprises a guide rod, a lifting motor and a lifting transmission mechanism, the rotating operation portion comprises a rotating motor and a rotating transmission mechanism which is used for connecting the guide rod with the rotating motor, and a gap between the guide rod and the cavity body is sealed. The plasma etcher loading system has the advantages of being large in productivity of the sheet tray and capable of achieving batch machining.

Description

technical field [0001] The invention relates to the field of plasma etching machines, in particular to a loading system of a plasma etching machine. Background technique [0002] Plasma etching is the most common form of dry etching. Its principle is that the gas exposed to the electron area forms a plasma, and the resulting ionized gas and gas composed of released high-energy electrons form a plasma or ion , when the ionized gas atoms are accelerated through an electric field, they release enough force with surface repelling forces to tightly bond materials or etch surfaces. [0003] Etching is an important process in the manufacturing process of semiconductors, microelectronics and LEDs. Etching is the process of selectively removing unnecessary materials from the surface of silicon wafers or sapphire substrates by chemical or physical methods. With the integration of semiconductor devices With the improvement of precision, the line width of semiconductor devices is getti...

Claims

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Application Information

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IPC IPC(8): H01J37/32H01J37/20
Inventor 张钦亮平志韩苏静洪王谟陈骝
Owner TDG MACHINERY TECH
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