light emitting device
A light-emitting device and light-emitting element technology, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems of not being able to effectively suppress vulcanization and hinder the effective reflection of light, and achieve the goals of preventing corrosion and vulcanization, improving brightness, and improving quality Effect
Active Publication Date: 2017-07-14
NICHIA CORP
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Problems solved by technology
[0009] However, in general, if silver or silver alloy is used as a material for lead frames, leads, etc., these parts will be vulcanized, and the vulcanization will cause absorption of light from the light-emitting element, resulting in the prevention of effective reflection of light The problem
[0010] Moreover, the current situation is that even if a resin whose composition can significantly suppress the vulcanization of silver is used, gas and liquid can invade through extremely small gaps such as resin and resin or resin and lead frame, thereby vulcanization starts and expands, and as a result, it cannot be effectively Inhibit vulcanization
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[0107] Such as Figure 1A , 1B and figure 2 As shown, the light emitting device 10 of this embodiment is mainly composed of a plurality of light emitting elements 11a, 11b, lead frames 12a, 12b, and a package 13, and is configured as a side view type.
[0108] The light-emitting elements 11a, 11b, for example, sequentially arrange an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer on a substrate, expose a part of the surface of the n-type semiconductor layer, form an n-electrode on the surface, and have an electrode disposed on the n-electrode. the n-pad electrode. In addition, a p-electrode is formed on substantially the entire surface of the p-type semiconductor layer, and a p-pad electrode is arranged on the p-electrode, and the light-emitting elements 11a, 11b are mounted on the lead frames 12a, 12b facing upward.
[0109]The lead frames 12a and 12b have a region where the light emitting element is mounted and electrically connected ...
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The present invention provides a light-emitting device that adopts a structure that achieves miniaturization and thinning of the light-emitting device and prevents gaps between resin, lead frames, leads, etc. in the light-emitting device, thereby not only preventing Vulcanization of silver-containing metal parts used in light-emitting devices can also more effectively extract light emitted from light-emitting elements. The light-emitting device includes: a plurality of light-emitting elements (11a, 11b), a plurality of lead frames (12a, 12b) carrying the light-emitting elements, and a package body (13). The package body (13) is formed of resin and has an opening (13a). , a part of the lead frame is embedded inside the package, and the other part is exposed at the bottom surface of the opening (13a). There is a resin bottom surface (13e) that exposes resin on the bottom surface of the opening (13a) of the package body (13). There is a wall portion (13b) protruding from the bottom surface of the opening between the light-emitting elements in the opening. The light-emitting elements and the wall portion are crossed (13b) lead connection.
Description
technical field [0001] The invention relates to a light emitting device. Background technique [0002] In recent years, high-brightness, high-power light-emitting elements and small light-emitting devices have been developed and used in various fields. Due to their small size, low power consumption, and light weight, these light-emitting devices are used in mobile phones, LCD backlights, light sources for various instruments, and various reading sensors. Try (such as Patent Document 1, Patent Document 2, etc.). [0003] As an example of various attempts, a proposal has been made in which, for example, a metal member made of silver or a silver alloy is used as a metal member applied to a lead frame, and a metal member made of silver or a silver alloy is used as a lead wire applied to a wire bonding. The fabricated lead thereby further suppresses the absorption of light from the light-emitting element, thereby effectively reflecting light and extracting light. [0004] In a...
Claims
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IPC IPC(8): H01L33/48H01L33/54H01L25/075
CPCH01L23/3107H01L24/45H01L24/48H01L25/0753H01L33/62H01L2224/45015H01L2224/45124H01L2224/45139H01L2224/45144H01L2224/45147H01L2224/45169H01L2224/4809H01L2224/48137H01L2224/48247H01L2224/48465H01L2924/00011H01L2924/00014H01L2924/01006H01L2924/01015H01L2924/01047H01L2924/01322H01L2924/12035H01L2924/12036H01L2924/12041H01L2924/00015H01L2924/00H01L2924/0002H01L2224/43H01L2924/01049H01L2224/85399H01L2224/05599H01L2224/43848
Inventor 金田守人濵田健作
Owner NICHIA CORP