Light emitting diode encapsulation structure and light emitting diode encapsulation method

A technology for light-emitting diodes and packaging structures, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as the inability to meet diverse products, limit LED applications, etc., and achieve the simplification of packaging technology, and the improvement of luminous uniformity and consistency. Effect

Inactive Publication Date: 2013-08-07
LEXTAR ELECTRONICS (SUZHOU) CORP +1
View PDF4 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, since the luminescent color of the chip itself can only be selected in a certain way, the phosphor powder mixed with it in the transparent colloid

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light emitting diode encapsulation structure and light emitting diode encapsulation method
  • Light emitting diode encapsulation structure and light emitting diode encapsulation method
  • Light emitting diode encapsulation structure and light emitting diode encapsulation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] See figure 1 and figure 2 , figure 1 Shown is a schematic diagram of a first embodiment of a light emitting diode packaging structure according to the present invention, figure 2 shown as figure 1 The schematic diagram of the light-emitting diode packaging structure before packaging. The present invention provides a light emitting diode packaging structure 11, which can be used for backlight or lighting products. The light emitting diode packaging structure 11 includes a light emitting diode light bar 12 and a fluorescent transparent tube body 13. The LED light bar 12 includes a first substrate 14 and at least one LED 15 disposed on the surface of the first substrate 14, and the LED light bar 12 has a light-emitting surface 16, wherein the light-emitting surface 16 of the LED light bar 12 is also The light-emitting surfaces of these light-emitting diodes 15 . In contrast, the light-emitting diode 15 can have one or more light-emitting diode chips. The transparen...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a light emitting diode encapsulation structure and a light emitting diode encapsulation method. The light emitting diode encapsulation structure comprises a light emitting diode lamp bar and a transparent phosphor tube. The light emitting diode lamp bar comprises a first substrate, at least one light emitting diode disposed on the surface of the first substrate and a light emitting face. The transparent phosphor tube comprises a transparent tube body and fluorescent glue sealed in the transparent tube body. The transparent phosphor tube is detachably disposed on one side of the light emitting diode lamp bar to cover the light emitting diodes. Light emitted by the light emitting diodes passes the transparent phosphor tube and irradiates to the outside. By the encapsulation structure, light emitting diode encapsulation is simplified, light emitting uniformity and consistency of the light emitting diode lamp bar are improved, and product diversity is achieved.

Description

technical field [0001] The present invention relates to a packaging structure and a packaging method of a light emitting diode, in particular to a packaging structure and a packaging method of a light emitting diode that can improve product diversity. Background technique [0002] With the further improvement of light-emitting diode (LED) luminous efficiency, its application fields are also further expanded. In addition to being used as a backlight, especially high-power white LEDs, with the gradual increase in cost performance, they will gradually replace traditional lighting sources and become A new generation of green light source. [0003] In order to make the light-emitting diode emit white light for application in the lighting field, phosphor powder is usually added to the packaging material of the light-emitting diode. The phosphor powder absorbs the light emitted by the LED grain and emits light of the second wavelength, and the light emitted by the LED chip and the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L33/48H01L33/50H01L25/075H01L33/00
Inventor 吴升达彭浩薛江杜天嘉
Owner LEXTAR ELECTRONICS (SUZHOU) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap