Light emitting diode encapsulating structure and manufacturing method thereof

Abstract

The invention discloses a manufacturing method of a light emitting diode encapsulating structure, which provides a loader and at least one light emitting diode chip which is provided with a light outlet surface and a plurality of side surfaces. The invention provides a first shade which is provided with at least one first opening; and the first opening at least exposes out of the light emitting diode chip. A spray coating device is arranged above the first shade for carrying out a first spray coating technology. The spray coating device is used for carrying out reciprocating spray coating on first fluorescent solution along a route so that the light outlet surface and the side surfaces of the light emitting diode chip are coated conformally by the first fluorescent solution. A first curing technology is carried out for curing the first fluorescent solution into a first fluorescent layer. An encapsulating colloid is formed for coating the first fluorescent layer and a part of the loader.

Description

technical field [0001] The present invention relates to a semiconductor packaging structure and a manufacturing method thereof, and in particular to a light emitting diode packaging structure and a manufacturing method thereof. Background technique [0002] Light-emitting diodes have advantages such as long life, small size, high shock resistance, low heat generation, and low power consumption, so they have been widely used as indicators or light sources in households and various equipment. In recent years, light-emitting diodes have developed towards multi-color and high brightness, so their application fields have been extended to large outdoor billboards, traffic lights and related fields. In the future, light-emitting diodes may even become the main lighting source with both power saving and environmental protection functions. [0003] It is known that since the packaging structure of light emitting diodes is manufactured by mass production, the packaging colloid will b...

AI Technical Summary

Problems solved by technology

However, since the encapsulant contains fluorescent material, during the process of waiting for baking, the fluorescent material will settle due to the long time that the encapsulant is filled in the cavity of the chip or the timing of filling the glue is different, resulting in the generation of fluorescent material. The phenomenon of uneven distribution (that is, most of the fluorescent materials settle on the bottom surface of the chip cavity or the chip surface), and only a small part of the fluorescent materials are scattered in the encapsulation body, which in turn affects the light output of the produced LED packaging structure Evenness

[0004] In addition, since the shapes of the carriers of the known light emitting diode packaging structure are different, if the fluorescent layer is formed on the light emitting diode chip by means of fluorescent coating process, the machine equipment must be adjusted for different carriers, thus reducing the production efficiency and increase production cost

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