Automatic ball mounter for BGAs (ball grid arrays)

A technology of planting balls and racks, applied in the direction of tin feeding devices, auxiliary devices, electrical components, etc., can solve the problems of frequent missed ball planting and complicated processes, and achieve the effects of avoiding scattering and waste, simple operation and good automation

Active Publication Date: 2013-08-21
SHENZHEN ZHUO MAO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a BGA automatic ball planting machine to overcome the above-mentioned shortcomings of relying on manual completion, complicated process and frequent missing ball planting in the current prior art

Method used

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  • Automatic ball mounter for BGAs (ball grid arrays)
  • Automatic ball mounter for BGAs (ball grid arrays)
  • Automatic ball mounter for BGAs (ball grid arrays)

Examples

Experimental program
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Embodiment Construction

[0037] Such as Figure 1-16 As shown, a BGA automatic ball planting machine described in the embodiment of the present invention includes a frame 1, and the front end of the frame 1 is provided with an industrial computer display screen 2, an emergency stop button 3, Industrial computer button 4, start button 5, pause button 6, USB interface 7 and keyboard box 8, wherein emergency stop button 3, industrial computer button 4, start button 5 and pause button 6 are listed in a row, the frame 1 The front end is provided with a flip door 9, a material discharge window 10 and a cost storage unit 11 from top to bottom on the right side. The front side of the flip door 9 is provided with a transparent window 12. The top of the flip door 9 is provided with a nitrogen spring 19. 1 is provided with a side door 13 on the right side, a cooling system 14 and an exhaust system 15 are provided at the top of the frame 1, foot cups 16 are respectively provided at the four corners of the lower e...

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PUM

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Abstract

The invention relates to an automatic ball mounter for BGAs (ball grid arrays). The automatic ball mounter comprises a framework; an industrial personal computer display screen, an emergency stop button, an industrial personal computer button, a start button, a pause button, an USB (universal serial bus) interface and a keyboard box are sequentially arranged at the front end of the framework from top to bottom and are close to the left side of the framework, a flap door, a placing window and a cost memory unit are sequentially arranged at the front end of the framework from top to bottom and are close to the right side of the framework, and cooling systems and a ventilating system are arranged on the top of the framework; and a BGA clamping device is connected with a conveying and feeding device, a light curtain detecting mechanism, an industrial camera photographing device and a turret mounting device are arranged on the left side of the conveying and feeding device, and a solidifying device and a solder paste adhering device are arranged on the right side of the conveying and feeding device. The automatic ball mounter has the advantages that solder balls are automatically sorted without a steel mesh and are prevented from scattering and being wasted; the automatic ball mounter can be automatically positioned, sizes and thicknesses of the BGAs can be automatically identified, and the squeezing quantity can be automatically adjusted; and the automatic ball mounter is simple in operation and high in automation degree, speed and precision, the cost is reduced, and the precision is guaranteed.

Description

technical field [0001] The invention relates to a BGA automatic ball planting machine. Background technique [0002] In recent years, due to the increasingly strong demand of electronic products for thin, light, high frequency, high efficiency and multi-function, BGA and CSP packaging have developed rapidly, and they have replaced the traditional pin packaging and lead frame packaging technology, which makes a A new packaging material that plays the role of electrical interconnection and mechanical support - solder balls came out. Packaged devices such as BGA and CSP connected by solder balls have been widely used in notebook computers, mobile phones, PDAs, DSCs, LCDs and 3C products. At present, the existing BGA chip solder ball packaging process is to scrape a layer of solder paste on the BGA chip, squeeze the solder ball through the corresponding steel mesh ball table, and then stabilize and solidify, which can only be done manually. . For BGAs of different sizes, it i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00B23K3/08B23K3/06H01L21/60
Inventor 闻权
Owner SHENZHEN ZHUO MAO TECH
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