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Curable resin composition, cured product, surface-processed cured product, and laminate

A technology of curable resin and composition, which is applied in the fields of surface treatment cured products and laminates, curable resin compositions, and cured products. It can solve the problems of high manufacturing costs and complicated manufacturing processes, and achieve excellent adhesion, Small surface roughness and excellent electrical properties

Active Publication Date: 2013-08-28
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] However, as a result of investigation by the inventors of the present invention, it was found that the technique described in Patent Document 1 has the following problems: it requires a process of bringing a compound having a structure capable of coordinating with a metal into contact with the surface of the resin layer, the production process is complicated, and the production cost is reduced. high

Method used

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  • Curable resin composition, cured product, surface-processed cured product, and laminate
  • Curable resin composition, cured product, surface-processed cured product, and laminate

Examples

Experimental program
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Embodiment

[0159] Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples. In addition, unless otherwise specified, the part and % in each example are a weight standard. Various physical properties were evaluated according to the following methods.

[0160] (1) Amount of monomer in the polymerization solution: The polymerization solution was diluted with tetrahydrofuran, and measured by gas chromatography (GC) to determine the amount of monomer in the polymerization solution.

[0161] (2) Number-average molecular weight (Mn) and weight-average molecular weight (Mw) of the polymer: measured by gel permeation chromatography (GPC) using tetrahydrofuran as a developing solvent, and obtained as polystyrene-equivalent values.

[0162] (3) The hydrogenation rate of the polymer: The hydrogenation rate refers to the ratio of the number of moles of hydrogenated unsaturated bonds to the number of moles of unsaturated bonds in the polyme...

Synthetic example 1

[0172] As the first stage of polymerization, 35 parts by mole of 5-ethylene-bicyclo[2.2.1]hept-2-ene (hereinafter, abbreviated as "EdNB"), 0.9 parts by mole of 1-hexene, and 340 parts by anisole Mole parts and 4-acetoxybenzylidene (dichloro)(4,5-dibromo-1,3-bis(trimethylphenyl)-4-imidazoline-2-ylidene) as a ruthenium-based polymerization catalyst (Tricyclohexylphosphine)ruthenium (C1063, manufactured by Wako Pure Chemical Industries, Ltd.) 0.005 mole parts were charged into a pressure-resistant glass reactor replaced with nitrogen, and polymerization was carried out at 80° C. for 30 minutes while stirring to obtain norbornenes. Ring-opened polymer solution.

[0173] Next, as the second stage of polymerization, tetracyclic [9.2.1.0 2,10 .0 3,8 ]Tetradec-3,5,7,12-tetraene (methanotetrahydrofluorene, hereinafter, abbreviated as "MTF".) 35 parts by mole, bicyclo[2.2.1]hept-2 -ene-5,6-dicarboxylic acid anhydride (hereinafter referred to as "NDCA") 30 mole parts, anisole 250 mole...

Synthetic example 2

[0176] Put 70 molar parts of MTF, 30 molar parts of NDCA, 0.9 molar parts of 1-hexene, 590 molar parts of anisole and 0.015 molar parts of C1063 into a pressure-resistant glass reactor replaced by nitrogen, and carry out the reaction at 80°C for 1 hour under stirring. Polymerization reaction to obtain norbornene ring-opening polymer solution. As a result of measuring this solution by gas chromatography, it was confirmed that substantially no monomer remained, and the polymerization conversion rate was 99% or more.

[0177] Next, the obtained ring-opening polymer solution was placed in a high-pressure reactor equipped with a stirrer replaced with nitrogen, and stirred at 150° C. under a hydrogen pressure of 7 MPa for 5 hours to perform a hydrogenation reaction to obtain a hydrogenated product of a norbornene-based ring-opening polymer. That is, the alicyclic olefin polymer (A-2) solution. The obtained polymer (A-2) had a weight average molecular weight of 50,000, a number aver...

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Abstract

Provided is a curable resin composition comprising a polar group-containing alicyclic olefin polymer (A), a curing agent (B), a hindered phenol compound (C), and a hindered amine compound (D). This curable resin composition is capable of providing a cured product having little surface roughness when surface processed using a permanganate aqueous solution, excellent adhesion to a conductor layer, high peel strength, and excellent electrical characteristics.

Description

technical field [0001] The present invention relates to a curable resin composition, a cured product, a surface-treated cured product, and a laminate. Background technique [0002] With the pursuit of miniaturization, multi-function and high-speed communication of electronic equipment, higher density of circuit boards used in electronic equipment is required. In order to meet the demand for higher density, multilayering of circuit boards is required. Such a multilayer circuit is basically formed, for example, by laminating an electrical insulating layer on an inner layer substrate composed of an electrical insulating layer and a conductive layer formed on the surface thereof, forming a conductive layer on the electrical insulating layer, and repeating these electrical insulating layers. Lamination of layers and formation of conductor layers. [0003] The wiring rules of multilayer circuit boards tend to become finer year by year, especially in applications called interposer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L65/00B32B15/085B32B27/00C08K5/13C08K5/3435H01L23/12H01L23/14H05K1/03
CPCH01L23/145H01L23/49894H05K1/0353C08L65/00C08K5/1345C08K5/3435C08K9/06H01L2924/0002C08K3/36C08K5/13C08L63/00Y10T428/31681H01L2924/00C08L23/00B32B15/085B32B27/00H01L23/12H05K1/03H05K1/0296
Inventor 藤村诚伊贺隆志
Owner ZEON CORP