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Probe card detecting method

A detection method and probe card technology, applied in the direction of measuring devices, measuring electrical variables, instruments, etc., can solve the problem of complex process of whether the probe card is qualified or not

Active Publication Date: 2013-09-11
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The problem solved by the present invention is that, in the prior art, the process of detecting whether the probe card is qualified before the wafer test is very complicated

Method used

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Embodiment Construction

[0034] The inventor obtained a probe card detection method through creative work.

[0035] In this embodiment, the steps of the new probe card detection method are:

[0036] First, a wafer is provided, and multiple conductive regions are distributed on the wafer. The number of conductive regions is greater than or equal to the number of probes on the probe card. Any two conductive regions are electrically connected and any conductive region is only connected to one of the conductive regions. electrical connection.

[0037] Next, align all the probes on the probe card with the conductive regions on the wafer.

[0038] Afterwards, a voltage is applied between the two probes that are opposite to the two conductive areas that are electrically connected. Since the two conductive areas are short-circuited, the current between the two probes is tested. The ratio of the voltage to the current is: and The contact resistance between two probes that are electrically connected to the pa...

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PUM

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Abstract

A probe card detecting method includes: providing a wafer, wherein a plurality of conducting areas are distributed on the wafer, at least two conducting areas are electrically connected, and a random conducting area is electrically connected with one conducting area; aligning probes on a probe card to the conducting areas on the wafer; detecting contact resistance between the two probes aligned to the two conducting areas which are electrically connected; if the contact resistance is within an expected resistance range, judging the two probes corresponding to the contact resistance to be qualified; and if the contact resistance exceeds the expected resistance range, judging the two probes corresponding to the contact resistance to be unqualified. By the aid of the probe card detecting method, every probe can be accurately detected whether to have a problem or not, so that existing problems can be further detected in follow-up processes, and the probe card can be replaced or maintained timely. Furthermore, faulted probes can be found early, influence on follow-up wafer tests from the faulted probes is eliminated, and accuracy of the wafer tests is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a detection method of a probe card. Background technique [0002] In the field of semiconductor technology, before integrated circuit packaging, it is necessary to use probes to perform functional tests on wafers, select unqualified products and then carry out subsequent packaging projects, which can avoid waste caused by continued processing of bad products. The probe card (Probe Card) is responsible for the electrical connection between the test system and the integrated circuit chip. When performing a functional test on the wafer, the probes on the probe card make one-to-one contact with the pads on the chip, and output test signals to the wafer or receive signals output by the wafer. [0003] Therefore, probe cards play an important role in wafer testing. Among them, the alignment of each pad and probe is necessary. If the contact between the probe card and the pad i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R35/00
Inventor 唐莉
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP