Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High frequency heating apparatus

A high-frequency heating device and high-frequency technology, applied in microwave heating, glass manufacturing equipment, glass tempering and other directions, can solve the problems of electric field distribution control inside difficult chambers, glass heating heating efficiency, low temperature rise rate, etc. Effects of preventing electric field concentration, improving energy efficiency, and increasing the rate of temperature rise

Active Publication Date: 2013-09-18
SAMSUNG CORNING PRECISION MATERIALS CO LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Also, in the case of heat-treating large-sized flat glass by employing high-frequency technology in the related art, the disadvantage of using a single high-frequency generator is that it is difficult to control the electric field distribution inside the chamber and the rate of temperature rise is low.
Although the use of multiple high-frequency generators increases the rate of temperature rise to some extent, the concentration of the electric field due to interference between high-frequency generators causes localized heating of the glass and a decrease in heating efficiency, which becomes a problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High frequency heating apparatus
  • High frequency heating apparatus
  • High frequency heating apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] Reference will now be made in detail to the high frequency heating apparatus according to the present invention, examples of which are shown in the accompanying drawings and described below, so that those of ordinary skill in the art to which the invention pertains can easily practice the invention.

[0037] Throughout this document, references are made to the drawings, the same reference numbers being used throughout the different drawings to designate the same or like parts. In the following description of the present invention, a detailed description of known functions and components incorporated herein will be omitted when they may make the subject matter of the present invention unclear.

[0038] In addition, in the following description, a direction from the front to the rear is defined as a direction in which the substrate is carried, and a direction from left to right is defined as a direction intersecting the direction in which the substrate is carried.

[0039...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
Login to View More

Abstract

A high frequency heating apparatus which heats a substrate by applying high frequency waves. The high frequency heating apparatus includes a high frequency generator which generates high frequency to heat the substrate and a reflector which reflects the high frequency generated by the high frequency generator toward the substrate.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2012-0022639 filed Mar. 6, 2012, the entire contents of which are hereby incorporated by reference for all purposes. technical field [0003] The present invention relates to a high-frequency heating device, and more particularly to a high-frequency heating device for heating a substrate by using high-frequency waves. Background technique [0004] The use of glass materials is rapidly increasing in various industrial fields, in particular as photovoltaic cells, devices such as thin film transistor liquid crystal displays (TFT-LCD), plasma display panels (PDP) or organic electroluminescence (EL) Covering layers for flat panel displays and various mobile electronic devices, etc. Accordingly, glass materials are required to have light weight and thin topography. [0005] However, the trend of glass materials towards light and thin topologies leads to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C03B27/012
CPCC03C23/0065H05B6/78H05B6/80H05B6/64
Inventor 李会官尹敬敏曹瑞英权润瑛南真守朴敬旭崔宰荣
Owner SAMSUNG CORNING PRECISION MATERIALS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products