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Micromechanical acoustic transducer device and corresponding manufacturing method

An acoustic transducer and micro-mechanical technology, applied in the directions of microstructure devices, manufacturing microstructure devices, speaker screens, etc., can solve the problems of multi-package technology, cost-intensive packaging, cost-intensive, etc., and achieve high integration density and low structure height. Effect

Active Publication Date: 2019-03-15
ROBERT BOSCH GMBH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Micromechanical (mikromechanisch) loudspeaker devices, also known as MEMS loudspeaker devices, currently require complex and expensive packaging technologies
The complex separation of the delicate, unencapsulated MEMS structure and its encapsulation (usually a film) with an acoustic window results in encapsulation costs of the order of 1 Euro per chip, and these encapsulation costs are therefore of the order of magnitude for other micromechanical sensors such as 20 to 30 times the package cost of an inertial sensor

Method used

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  • Micromechanical acoustic transducer device and corresponding manufacturing method
  • Micromechanical acoustic transducer device and corresponding manufacturing method

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Embodiment Construction

[0023] exist figure 1 , reference numeral 1 denotes an electrical printed circuit board, which has a front side VS and a back side RS. On the front side VS, the printed circuit board 1 is flip-chip equipped with an ASIC 2 and a micromechanical speaker structure 3 . Electrically small solder balls as flip-chip bonds (Flip-Chip-Bond) are designated with reference numeral 4a. For reasons of simplification, the rewiring (Umverdrahtung) implemented in the printed circuit board is figure 1 is not shown. The micromechanical loudspeaker structure 3 can be protected against the environment, for example, by a surrounding solder frame 4b. As an alternative thereto, an adhesive film can be provided instead of the surrounding solder frame 4b, whereby no electrical contact is made, but only mechanical protection.

[0024] Furthermore, the printed circuit board 1 has a hole-shaped opening 5 which is mechanically closed on the rear side RS of the printed circuit board 1 with a protective ...

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Abstract

The invention realizes a micromechanical acoustic transducer device and a corresponding manufacturing method. The micromechanical sound transducer device comprises an electrical printed circuit board (1) having a front side (VS) and a back side (RS); wherein on the front side (VS) is applied flip chip method The micromechanical sound transducer structure (3); and wherein the printed circuit board (1) has openings (5) for emitting sound waves (S) in the region of the micromechanical sound transducer structure (3).

Description

technical field [0001] The present invention relates to micromechanical acoustic transducer devices and corresponding manufacturing methods. Background technique [0002] Although in principle any micromechanical sound transducer arrangement can be used, such as loudspeakers and microphones, the invention and the problem on which it is based are explained with the aid of a silicon-based micromechanical loudspeaker arrangement. [0003] Micromechanical loudspeaker devices, also known as MEMS loudspeaker devices, currently require complex and expensive packaging technology. The complex separation of the delicate, unencapsulated MEMS structure and its encapsulation (usually a film) with an acoustic window results in encapsulation costs of the order of 1 Euro per chip, and these encapsulation costs are therefore of the order of magnitude for other micromechanical sensors such as 20 to 30 times the package cost of an inertial sensor. [0004] Packaging by means of mold packages...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/00H04R1/00B81C1/00B81B3/00
CPCH04R1/023H04R19/005H04R19/02H01L2224/16225H04R31/00H04R23/006
Inventor R.埃伦普福特M.布吕恩德尔A.格拉赫C.莱嫩巴赫S.克尼斯A.法伊U.肖尔茨
Owner ROBERT BOSCH GMBH
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