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Ceramic metallization structure and manufacturing method of ceramic metallization structure

A technology of ceramic metallization and manufacturing methods, which is applied in the direction of chemical instruments and methods, ceramic layered products, layered products, etc., can solve the problems of multilayer ceramic process compatibility and increase costs, so as to improve metallization strength and reduce costs Effect

Active Publication Date: 2015-05-20
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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Problems solved by technology

[0003] The metallization strength is determined by the bonding force between the metallization layer and the ceramic, which is related to the metallization slurry formula and sintering process, but the change of metallization slurry formula and sintering process is often difficult to be compatible with the original multilayer ceramic process , and substantially increase the cost of

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  • Ceramic metallization structure and manufacturing method of ceramic metallization structure
  • Ceramic metallization structure and manufacturing method of ceramic metallization structure
  • Ceramic metallization structure and manufacturing method of ceramic metallization structure

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Embodiment Construction

[0013] Such as Figure 2 to Figure 3 As shown, the ceramic metallization structure of the present invention includes a ceramic substrate 1, a metallization layer 2 arranged at the metal-ceramic sealing interface and a solder resist layer 3 covering at least the edge of the metallization layer 2, solder 4, and a metal wire frame 5 , and lead 6. According to the position of the solder resist layer, the solder resist layer 3 can be divided into two parts: a solder resist area 31 and a strengthened area 32. The solder resist area 31 covers the edge of the metallized layer 2, and the strengthened area 32 is sintered on the ceramic substrate 1. The layer not covered by the welding layer is the welding area 21 . The width of the soldering area is 300 microns to 800 microns, the width of the solder resist area is 200 microns to 500 microns, the width of the strengthening area is 300 microns to 800 microns, the thickness of the metallization layer is 10 microns to 30 microns, and the ...

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Abstract

The invention discloses a ceramic metallization structure and a manufacturing method of the ceramic metallization structure. The ceramic metallization structure comprises a ceramic substrate, metallization slurry, and a soldering resistant agent. The metallization slurry is overprinted on a metal-ceramic sealing interface to form a preset pattern, and after the metallization slurry is dried, the soldering resistant agent is overprinted, along edges of the preset pattern, on edge areas of the ceramic substrate and the metallization slurry. The metallization slurry and the soldering resistant agent are both burnt at high temperature to respectively form a metallization layer and a soldering resistant layer. According to the ceramic metallization structure and the manufacturing method of the ceramic metallization structure, stress-caused cracking and separation between the metallization layer and the ceramic substrate can be avoided, and metallization strength is increased, so the ceramic metallization structure and the manufacturing method of the ceramic metallization structure can be widely used in various metal ceramic sealing.

Description

technical field [0001] The invention relates to a welding structure and a welding method, in particular to a structural design and a method for improving ceramic metallization strength. Background technique [0002] Ceramics have the advantages of high mechanical strength, good insulation performance, low high-frequency loss, high electrical strength, high temperature resistance, and thermal shock resistance, and are the most widely used electronic ceramic materials. Such as figure 1 As shown, the ceramic 11 and the metal 15 cannot be directly welded, and a layer of metal film 12 needs to be sintered on the surface of the ceramic, that is, metallization. Metallization is the process of printing metallization paste on the surface of alumina ceramic blank, and the paste forms a layer of metal film on the ceramic surface during the ceramic sintering process. Higher metallization strength can ensure that the bonding surface between the metal and the ceramic will not be damaged...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B18/00C04B41/89
Inventor 戴洲庞学满严蓉
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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