PCB-Based RF Power Package Window Framework
A frame and substrate technology, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve problems such as large leakage, reduce reliability product loss, etc.
Active Publication Date: 2016-04-13
CREE INC
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, LCP window frame type packages have inherent large leakage issues which lead to reduced reliability and higher product loss
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0019] An embodiment of a PCB (Printed Circuit Board) based power semiconductor package is described next. The package has a metal substrate and a PCB based window frame. The source side of the radio frequency power transistor die is connected to the substrate. A PCB based window frame isolates the source from the gate and drain arranged at the side of the die opposite the source. The package can be closed with an optional ceramic, LCP or PCB based lid such that the package is an open cavity package. In all cases, PCB based window frames are more cost effective, provide better CTE matching to the substrate, and allow high flexibility in lead configuration for both straight lead and surface mount configurations. For example, a copper substrate and a PCB-based window frame with copper traces have very closely matched CTEs. PCB based window frames are also rigid and thus more stable and less prone to bending. In addition, PCB-based packages have improved RF transmission chara...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a PCB-based radio frequency power packaging window frame. A semiconductor package includes a substrate having a die attach area and a peripheral area, a transistor die having a first terminal attached to the die attach area and second and third terminals facing away from the substrate, and a a frame, the electrically insulating member having a first side attached to a peripheral region of the substrate, a second side facing away from the substrate, a first metal layer at the first side of the insulating member, and a second metal layer. The insulating member extends outwardly beyond the lateral sidewalls of the substrate. A first metal layer is attached to a portion of the first side extending outward beyond the lateral sidewall of the substrate. The first and second metal layers are electrically connected at regions of the insulating member spaced apart from the lateral sidewalls of the substrate.
Description
technical field [0001] The present application relates to radio frequency power packages, in particular window frames for radio frequency power packages. Background technique [0002] An air-cavity package for RF power applications includes an RF power transistor die with a source terminal attached to a metal flange and a Window frame in ceramic (alumina). Such packages are relatively expensive and have poor CTE (coefficient of thermal expansion) matching. Standard RF power packages are often constructed using CPC (copper, copper-molybdenum, copper stacked flanges), CuW or CuMo flanges, which Landu has a CTE closely matched to ceramics. However, flanges tend to have a much lower CTE than system cooling blocks / coins that are welded to the flange. CTE mismatch between flange and cooling block / sheet creates solder fatigue, component cracking and bowing issues. Furthermore, there is a CTE match to the leads such that the window frame and corresponding leads are CTE matched ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/14H01L23/495H01L21/60H01L21/58
CPCH01L2224/73265H01L24/29H01L24/32H01L24/48H01L24/49H01L24/73H01L24/83H01L24/85H01L2224/29144H01L2224/2919H01L2224/32245H01L2224/48195H01L2224/48227H01L2224/49109H01L2224/83447H01L2224/83805H01L2224/85447H01L2924/10272H01L2924/10329H01L2924/1033H01L2924/13055H01L2924/1421H01L2924/1531H01L2924/16251H01L2924/16787H01L2924/19041H01L2924/19105H01L23/047H01L23/10H01L23/13H01L23/49827H01L2924/01322H01L2924/13091H01L2924/1306H01L2924/1305H01L2924/00014Y02P80/30H01L2224/48137H01L2924/01014H01L2924/0105H01L2924/01042H01L2924/01074H01L2924/00012H01L2924/00H01L2224/45099H01L2224/45015H01L2924/207H01L25/0657H01L23/5226H01L23/345H01L21/76898H01L23/481H01L23/06H01L23/142H01L23/49844H01L2224/83801H01L2224/8385H01L2924/01028H01L2924/01029H01L2924/01046H01L2924/01079H01L2924/1304
Inventor 周顺荣B·康迪A·康波施
Owner CREE INC