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Laser wire-stripping method and device

A wire stripping device and laser technology, applied in circuit/collector parts, equipment for dismantling/armoring cables, electrical components, etc., can solve the problems of low degree of automation, high labor cost, low wire stripping efficiency, etc. High degree of automation, reduced labor costs, and high stripping efficiency

Active Publication Date: 2013-10-23
HANS LASER TECH IND GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a laser wire stripping method, which aims to solve the problems of low stripping efficiency, high labor cost, low degree of automation and incomplete wire stripping in the prior art

Method used

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  • Laser wire-stripping method and device

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Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0020] The invention provides a laser wire stripping method, as follows:

[0021] Set up a laser generating mechanism that can generate a single beam of laser light;

[0022] Set up two laser vibration scanning mechanisms on both sides of the wire that needs to be stripped, so that the light output direction of the laser vibration scanning mechanism is perpendicular to the arrangement direction of the wire, and the laser scanning emitted by it is within the scanning area the wire;

[0023] A light splitting mechanism is provided, and the single beam of laser light generated by the laser generatin...

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Abstract

The invention relates to the technical field of wire stripping methods and discloses a laser wire-stripping method and device. The method is as follows: providing a laser generation device capable of generating a single beam of laser; providing two laser vibration environment scanning mechanisms which are arranged oppositely at two sides of a wire which needs to be stripped so that the light outlet direction of the laser vibration environment scanning mechanisms is vertical to the arrangement direction of the wire and laser sent by the laser vibration environment scanning mechanisms scans the wire which is in a scanning area; and providing a light splitting mechanism so that the single beam of laser which is generated by the laser generation device is split into two beams of laser which enter the two laser vibration environment scanning mechanisms respectively. The two laser vibration environment scanning mechanisms in the invention are capable of stripping an insulation layer of the wire in the scanning area at one time so that wire stripping efficiency is high and labor cost is reduced greatly; and wire stripping can be completed at one time so that no repeated operation is required. Thus manual operation is reduced, automation degree is high and a phenomenon of incomplete wire stripping is prevented.

Description

technical field [0001] The invention relates to the technical field of wire stripping methods, in particular to a laser wire stripping method and a laser wire stripping device using the method. Background technique [0002] The wire generally includes a metal wire and an insulating layer wrapped around the metal wire. In some current manufacturing fields, the insulating layer on the wire needs to be stripped to obtain the metal wire inside, referred to as stripped wire. [0003] In the traditional technology, the stripping operation of the wire generally adopts the mechanical contact type stripping. In this way, it is easy to cause damage to the metal wire in the wire, and there is a danger of injury to the wire itself. Moreover, for some wires that require special stripping operations Wire, the traditional mechanical stripping method is difficult to achieve. [0004] At present, lasers are mostly used to strip wires, and the methods of laser stripping wires that have been ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/28H02G1/12
Inventor 莫英付周刚任宁郑珺晖高云峰
Owner HANS LASER TECH IND GRP CO LTD