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Manufacturing method of multilayer printed circuit board

A manufacturing method and sub-board technology, which are applied in the directions of multi-layer circuit manufacturing, printed circuit components, and the formation of electrical connection of printed components, can solve the problem of high cost, and achieve the effect of reducing the manufacturing cost and omitting the grinding step.

Active Publication Date: 2016-12-14
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The present invention aims to provide a multi-layer PCB and its manufacturing method to solve the problem of high cost in the prior art

Method used

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  • Manufacturing method of multilayer printed circuit board
  • Manufacturing method of multilayer printed circuit board

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Embodiment Construction

[0018] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0019] figure 2 Shows a flow chart of a multilayer PCB manufacturing method according to an embodiment of the present invention, including:

[0020] In step S210 , making a sub-board, a plurality of double-sided panels can be laminated to form a sub-board.

[0021] Step S220, making the outer circuit pattern of the sub-board, and performing mechanical drilling (for making buried holes) on the laminated sub-board.

[0022] Step S230 , the pre-processing of the plug hole, may carry out roughening treatment on the sub-board after the circuit pattern production is completed, so as to enhance the bonding force between the resin and the copper foil.

[0023] Step S240, plugging holes: use resin to plug holes in the prefabricated sub-board, and the saturation of the resin in the plug holes is less than 100%, which provides conditions for...

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PUM

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Abstract

The invention provides a manufacturing method of a multi-layer printed circuit board (PCB). The manufacturing method comprises the steps of carrying out hole plugging on a sub-board by adopting resin, wherein the degree of saturation of the resin for hole plugging is smaller than 100%; baking the resin for hole plugging until semi-solidification; overlaying the sub-board and an adhesion piece alternately, and carrying out thermal press fit on the sub-board and the adhesion piece so as to obtain a multi-layer PCB. The invention further provides a multi-layer PCB manufactured by adopting the method. The manufacturing method provided by the invention reduces the manufacturing cost of the multi-layer PCB.

Description

technical field [0001] The present invention relates to the field of printed circuit boards (PCBs), and in particular to a method. Background technique [0002] The method of manufacturing the buried hole in the inner layer of a multilayer PCB is usually to first drill, electroplate, pre-process the plug hole (hole wall roughening), plug the hole, bake and cure, grind, and then perform subsequent circuit and build-up production. Wait. figure 1 A flow chart of making a multi-layer PCB according to the related art is shown, including: [0003] Step S110 , making a sub-board panel: a plurality of double-sided panels are laminated to form a sub-board panel. [0004] Step S120, making the outer circuit pattern of the sub-board: performing mechanical drilling, electroplating, and circuit pattern production on the laminated sub-board. In this production process, the dry film has high requirements on the hole-covering ability, otherwise it will cause holes. The dry film type and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/40H05K1/02
Inventor 唐国梁胡永栓
Owner NEW FOUNDER HLDG DEV LLC