Surface checking method of printed circuit board

Abstract

The invention relates to a surface checking method of a printed circuit board. The surface checking method comprises the following steps of: performing laser scanning on the surface of the printed circuit board to obtain a three-dimensional structure of the surface of the circuit board; converting the three-dimensional structure of the surface of the printed circuit board into a two-dimensional planar image; and contrasting the two-dimensional planar image with a design configuration of the surface of the printed circuit board so as to determine defect information of the surface of the circuit board. With the method, even if the surface of the printed circuit board is oxidized or roughed, various defects of the surface of the printed circuit board also can be detected; during the checking process, detection parameters do not need to be adjusted according to the type of a base material of the printed circuit board; meanwhile, information such as copper layer thickness also can be obtained, and more data is provided for understanding a manufacturing technology of the printed circuit board better.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to the quality inspection of printed circuit boards. Background technique [0002] With the fierce competition in the market, printed circuit board enterprises must ensure the quality of products, including long-term usability, electrical performance, etc., in order to occupy a place in the fiercely competitive market. Therefore, printed circuit board companies have strengthened the quality monitoring of each production link; at the same time, the graphics of printed circuit board circuits are becoming more and more refined, and the previous methods of visual inspection or manual optical inspection of printed circuit boards have been eliminated. It cannot adapt to the requirements of the market and technological development for printed circuit boards. Therefore, automatic optical inspection technology has been used on a large scale as a technical means o...

AI Technical Summary

Problems solved by technology

[0005]1) When the surface of the printed circuit board is oxidized, the automatic optical inspection equipment cannot distinguish whether it is the oxidized part of the surface of the printed circuit board or the real defect on the surface of the printed circuit board;

[0006]2) There are many types of printed circuit board substrates, and the optical properties of different substrates are different. After replacing the substrate, it is necessary to re-adjust the parameters of the automatic optical inspection equipment , otherwise, the error rate of the detection result increases

[0007]3) After the surface of the printed circuit board is roughened, the reflective ability of the copper surface becomes poor, and the automatic optical inspection equipment cannot distinguish the copper surface from the substrate, so , which cannot be QA'd

[0008]4) The automatic optical inspection equipment obtains plane information, which cannot detect the situation like copper drape at the hole of the drill hole, and cannot obtain such as the copper layer on the surface of the circuit board. Thickness and other information

[0009] An object of the present invention is to provide a surface inspection technology for printed circuit boards, which can not only detect whether there are possible failures of the printed circuit board during the production process or defects that affect electrical performance, and can solve problems with existing automatic optical inspection equipment

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