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Light emitting diode encapsulating structure

A technology of light-emitting diodes and packaging structures, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of uncontrollable orientation of glass fiber molecules and poor contact performance

Inactive Publication Date: 2013-10-30
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the uncontrollable orientation of glass fiber molecules, the contact performance between them and electrodes is usually poor.

Method used

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  • Light emitting diode encapsulating structure
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  • Light emitting diode encapsulating structure

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Experimental program
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Embodiment Construction

[0013] The light emitting diode packaging structure of the present invention will be further described below with reference to the figures.

[0014] See figure 1 , the LED packaging structure 10 provided by the embodiment of the present invention includes a substrate 110 , LED die 120 , reflective cup 130 and packaging material 140 .

[0015] The surface of the substrate 110 is provided with a first electrode 111 and a second electrode 112 , and the first electrode 111 and the second electrode 112 are insulated from each other to serve as two electrodes for external connection of the LED package structure 10 . In this embodiment, the first electrode 111 extends from the upper surface of the substrate 110 to the lower surface of the substrate 110 , and the second electrode 112 also extends from the upper surface of the substrate 110 to the lower surface of the substrate 110 . The first electrode 111 and the second electrode 112 are respectively disposed on two sides of the sub...

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Abstract

An LED package structure includes a substrate and an LED chip formed on the substrate. The substrate has a first electrode and a second electrode formed on an upper surface thereof. The LED chip is formed on the first electrode of the substrate and electrically connected with the first electrode and the second electrode respectively. The substrate is made of a composite including a base material and ceramic fibers mixed in the base material.

Description

technical field [0001] The invention relates to a light emitting diode packaging structure. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is an optoelectronic semiconductor element that can convert current into a specific wavelength range. Light-emitting diodes can be widely used as light sources in the field of lighting because of their advantages such as high brightness, low operating voltage, low power consumption, easy matching with integrated circuits, simple driving, and long life. [0003] The LED packaging structure generally includes a substrate and LED dies disposed on the substrate. The substrate is provided with electrodes connected to the positive and negative electrodes of the light emitting diode crystal grains. Generally, the substrate is usually composed of a matrix material and glass fibers mixed in the matrix material. However, since the alignment direction of glass fiber molecules cannot be controlled, the contact per...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L33/62
CPCH01L33/486H01L33/641H01L33/483H01L2224/48091H01L2924/00014
Inventor 罗杏芬
Owner ZHANJING TECH SHENZHEN