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Manufacturing method of combined printed circuit board, printed circuit board and manufacturing method thereof

A technology for printed circuit boards and manufacturing methods, which is applied in the direction of multilayer circuit manufacturing, printed circuit parts, and electrical connection formation of printed components, and can solve problems affecting PCB performance and low manufacturing precision of laminated circuit boards, and achieve Improve rigidity, not easily deformed, and ensure the effect of electrical connection

Active Publication Date: 2016-07-13
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Embodiments of the present invention provide a method for manufacturing a combined printed circuit board, a printed circuit board and a method for manufacturing the same, which are used to solve the problem that the existing laminated circuit boards have low manufacturing precision, thereby affecting the performance of the PCB

Method used

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  • Manufacturing method of combined printed circuit board, printed circuit board and manufacturing method thereof
  • Manufacturing method of combined printed circuit board, printed circuit board and manufacturing method thereof
  • Manufacturing method of combined printed circuit board, printed circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0096] Embodiment 1. The PCB includes at least one of the above-mentioned combined printed circuit boards and a conductive layer located on at least one outer surface;

[0097] Taking a 4-layer PCB as an example, the 4-layer PCB includes metal foils on the two outer surfaces and a combined printed circuit board on the inner layer. The manufacturing process is as follows Figure 11 Shown include:

[0098] Step 1101, stacking process, stacking two metal foils 1201 and one combined printed circuit board 1202 in the order of metal foil→combined printed circuit board→metal foil, such as Figure 12A As shown, the two insulating substrates of the combined printed circuit board are respectively combined with two metal foils;

[0099] Specifically, the metal foil 1201 can be copper foil, or other metal materials, and its thickness is above 3 μm;

[0100] Step 1102, lamination treatment, wherein the temperature of the lamination treatment is higher than the glass transition temperatur...

Embodiment 2

[0110] Embodiment 2, the PCB includes at least one combined printed circuit board, a conductive layer located on at least one outer surface, and at least one metal-clad plate filled with conductive paste;

[0111] Taking an 8-layer PCB as an example, the 8-layer PCB includes: metal foils on the two outer surfaces, two combined printed circuit boards on the inner layer, and a conductive paste filled between the two combined printed circuit boards. The metal clad plate, its manufacturing process such as Figure 15 Shown include:

[0112] Step 1501, stacking process, two metal foils 1601, two combined printed circuit boards 1602a and 1602b and a metal-clad plate 1603 filled with conductive paste are processed according to the order of metal foil→combined printed circuit board→filled with conductive paste The sequence of metal clad plate→combined printed circuit board→metal foil is combined and stacked, such as Figure 16A shown;

[0113] Step 1502, lamination treatment, wherei...

Embodiment 3

[0118] Embodiment 3, the PCB includes at least one combined printed circuit board and a metal-clad plate located on at least one outer surface;

[0119] Taking a 6-layer PCB as an example, the 6-layer PCB includes: metal-clad plates on the two outer surfaces, and a combined printed circuit board on the inner layer. The manufacturing process is as follows: Figure 17 Shown include:

[0120] Step 1701, stacking boards, combining two metal-clad boards 1801 and a combined printed circuit board 1802 in the order of metal-clad boards→combined printed circuit boards→metal-clad boards, such as Figure 18A shown;

[0121] Wherein the metal-clad board 1801 includes an insulating layer and metal foils located on the two outer surfaces of the metal-clad board 1801. It should be noted that the metal foil in the metal-clad board 1801 that is in contact with the combined printed circuit board is processed before lamination. Pattern transfer is necessary to form a conductive layer with cond...

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Abstract

The invention relates to the technical field of printed-circuit boards, in particular to a manufacturing method of a combined printed-circuit board, a printed-circuit board and a manufacturing method of the printed-circuit board. The manufacturing method of the combined printed-circuit board includes the steps that insulating base materials are attached to the upper surface and / or the lower surface of a metal coated plate, and the temperature of attaching processing is lower than the glass transition temperature of resin in the insulating base materials; the position, corresponding to a through hole in the metal coated plate, of the insulating base materials is drilled and the drilled hole and the through hole in the insulating base materials form an overlapped through hole; the overlapped through hole is filled with conductive paste to obtain the combined printed-circuit board. The insulating base materials are attached to the upper surface and / or the lower surface of the metal coated plate to obtain the combined printed-circuit board, due to the fact that the thickness of the combined printed-circuit board is larger than that of an exiting overlapped circuit board, the rigidity of the combined printed-circuit board is improved, the combined printed-circuit board will not deform in the drilling process, and the overlapped through hole is filled with the conductive paste easily.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a manufacturing method of a combined printed circuit board, a printed circuit board and a manufacturing method thereof. Background technique [0002] In recent years, with the development of miniaturization, light weight, high speed, multi-function and high reliability of electronic equipment, semiconductor components in electronic equipment are also developing towards multi-pin and fine-pitch. Facing this development trend, printed circuit boards (Printed Circuit Boards, PCBs), which are required to carry semiconductor components, are also developing towards miniaturization, light weight and high density. In order to meet this requirement, high-density interconnection (HDI: highdensityinterconnection) PCB has been researched and developed, but the high-density PCB produced by conventional manufacturing process has become more and more difficult to meet the develop...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/40H05K1/02
Inventor 黄勇陈正清苏新虹朱兴华
Owner NEW FOUNDER HLDG DEV LLC
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