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MEMS device including under bump metallization

A technology of under-bump metallization and micro-electromechanical system, which is applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problem of reducing the active area of ​​MEMS devices, etc.

Inactive Publication Date: 2017-05-10
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These UBMs significantly reduce the active area available for MEMS devices due to dicing constraints in bump placement

Method used

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  • MEMS device including under bump metallization
  • MEMS device including under bump metallization
  • MEMS device including under bump metallization

Examples

Experimental program
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Embodiment Construction

[0021] Figure 1 shows a cross-section of a MEMS microphone as known in the prior art. The surface of the MEMS microphone consists of an active part 1 and a circular UBM2. The active part includes the membrane. The membrane is placed directly above the backplate. The backplate and membrane are two electrodes and form a capacitor. By monitoring the capacitance of the capacitor, the device detects sound waves and can act as a microphone. Also the active part 1 may comprise further elements not shown in FIG. 1 .

[0022] Due to cutting constraints, the UBM 2 needs to have a minimum distance a from the edge 3 of the surface. In addition, the UBN 2 needs to have a minimum distance b from the active part 1 .

[0023] The UBM 2 occupies a relatively large area of ​​the MEMS microphone die due to its circular shape. Since the shape of the circular UBM 2 is not adjusted to the shape of the active part 1 or the shape of the corners, a lot of surface space is wasted and has to be le...

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PUM

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Abstract

The invention relates to a MEMS device comprising an under bump metallization (4) -UBM- to contact the device via flip-chip bonding to a substrate. The UBM (4) is placed on the surface of the MEMS device near the corners of the surface. In addition, the shape of the UBM (4) is adapted to the shape of the corners.

Description

technical field [0001] The present invention relates to microelectromechanical systems (MEMS) devices including under bump metallization (UBM). The UBM is used to contact the device via flip-chip bonding to the substrate. Background technique [0002] In flip-chip bonding, the MEMS device is in contact with the substrate via solder bumps. The UBM is the top metal layer on the MEMS device that forms a mechanically and electrically stable bond with the solder bumps. [0003] The area of ​​a standard UBM for flip-chip bonding is circular. These UBMs significantly reduce the active area available for MEMS devices due to dicing constraints in bump placement. Since MEMS devices are often fragile structures, it is advantageous to use laser dicing to separate such devices from the wafers used to produce them. However, the optical properties of the laser beam require a considerable metal void around the scribe line. Roughly speaking, a metal gap of 40% of the silicon wafer thick...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/00
CPCB81B7/007B81B2201/0257B81C2203/019H02N1/00
Inventor L.S.约翰森J.T.拉夫恩基尔德
Owner TDK CORPARATION