A transmission method and device for communication power semaphore

Abstract

The invention discloses a method and a device for transmitting signals of a communication power supply. The method comprises the steps that a first multiplexer receives a synchronous signal and a multi-channel detection signal of the communication power supply and receives a gating signal from an address input end; the first multiplexer transmits one of the synchronous signal and the multi-channel detection signal simultaneously according to the gating signal and transmits the synchronous signal and the multi-channel detection signal to a second multiplexer; the second multiplexer separates and outputs the synchronous signal and the multi-channel detection signal according to a gating signal of the second multiplexer. According to the method and the device, a time division multiplexing method is adopted, a few low-cost circuits are added, a few signal lines are used fro transmitting signals, so that connecting cables can be reduced greatly, signal interfaces can be simplified, and the transmission of the signals of the communication power supply can be achieved.

Description

technical field [0001] The present invention relates to the technical field of communication power supply, in particular to a method and device for transmitting signal quantities of communication power supply. Background technique [0002] The miniaturization of communication power supplies, from discrete multi-racks to integrated racks, to embedded power supplies; in terms of volume, cabinet heights range from 2200mm to 2000mm, 1600mm; depths range from 800mm to 600mm, 400mm. [0003] Most of the power modules use sub-boxes. With the continuous development of technology, the power density continues to increase, and the power module sub-boxes are getting smaller and smaller. At present, 1U*3U sub-boxes (with an output of up to 3000W) or even smaller sub-boxes are constantly appearing . [0004] Most of the power monitoring units also adopt the sub-box method, which is rapidly moving towards miniaturization, from 19’ standard sub-boxes, 2U*3U sub-boxes to the existing 1U*3U ...

AI Technical Summary

Problems solved by technology

[0009] 1) More slots of power modules are occupied, resulting in a decrease in system capacity (especially for embedded applications of small-capacity power supplies);

[0010] 2) There are many signal connections between the SIB and the backplane, the cables / cables are complex, prone to failure, and there are great constraints on the spatial location distribution (spatial distance, direction);

[0011] 3) The process structure design is complex and the reuse rate is very low

[0014] 1) The power distribution space is occupied more, resulting in a decrease in the utilization rate of the power distribution space;

[0015] 2) The size of the backplane is large and difficult to maintain;

[0016] 3) Front wiring is not as convenient as SIB

[0018] The disadvantage of this method is: there is a software part on the SIB board, it is inconvenient to upgrade / maintain, and it is difficult to guarantee the versatility

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