MEMS microphone structure and manufacturing method thereof

A manufacturing method and microphone technology, which are applied to electrostatic transducer microphones, sensors, electrical components, etc., can solve the problems of complex manufacturing process and packaging process, high cost, bulky volume, etc., and achieve the effect of improving anti-interference ability.
CN103391501AActive Publication Date: 2013-11-13MEMSEN ELECTRONICS

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
MEMSEN ELECTRONICS
Publication Date
2013-11-13

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention provides an MEMS microphone structure and a manufacturing method thereof. According to the MEMS microphone structure, a second conducting structure layer and a first conducting structure layer are attached through a first conducting adhered structure and a second conducting adhered structure in a face-to-face mode, wherein the second conducting structure layer and a second substrate jointly form a signal processing circuit, the first conducting structure layer is arranged on a first substrate provided with an MEMS microphone assembly, the first conducting structure layer comprises a first substrate conducting structure connected with the first substrate, and the second conducting structure layer comprises a second substrate conducting structure connected with the second substrate. Through the adoption of the MEMS microphone structure, when the EMS microphone assembly operates, the first substrate conducting structure and / or the second substrate conducting structure are / is connected with a ground potential or in ground connection through low impedance or connected with other screen potentials, external electric interference can be shielded, and antijamming capability of the MEMS microphone structure is improved.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a micro-electromechanical system technology, in particular to a MEMS microphone structure and a manufacturing method thereof. Background technique

[0002] MEMS (Micro-Electro-Mechanical Systems, Micro-Electro-Mechanical Systems) microphones using Micro-Electro-Mechanical Systems technology have become an alternative to Electret Condenser Microphones (ECM) using organic membranes due to their miniaturization and lightness. One of the top candidates.

[0003] MEMS microphones are miniature microphones made by etching pressure-sensing diaphragms on semiconductors through micro-electro-mechanical systems technology. They are commonly used in mobile phones, earphones, laptops, cameras and cars. Driven by the need for MEMS microphones to be compatible with CMOS and the further reduction in the size of MEMS microphones, the packaging structure of MEMS microphones has become a research hotspot. Many companies have invested a lot of m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More