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Protective tape

A technology of protective tape and metal layer, applied in the direction of film/sheet adhesive, electrical components, printed circuit manufacturing, etc. The effect of preventing tearing and preventing deterioration of operability

Inactive Publication Date: 2013-11-27
TATSUTA ELECTRICWIRE & CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the adhesive tape disclosed in Patent Document 1 is pasted on the substrate and undergoes a reflow process, the adhesive tape deteriorates due to the heat in the process, making it difficult to peel off and causing problems such as adhesive residue.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1 and comparative example 1）

[0071] Next, the present invention will be specifically described using Example 1 and Comparative Example 1 of the protective tape 1 of the present embodiment.

[0072] In Example 1, use such as figure 1The shown protective tape 1 of this embodiment is composed of a metal layer 14 , a resin layer 13 , and an adhesive layer 11 . Specifically, the metal layer 14 is formed of aluminum (Al) foil with a thickness of 9 μm. Furthermore, the resin layer 13 is formed of polyethylene terephthalate (PET), and has a thickness of 12 μm. In addition, the adhesive layer 11 is formed of acrylic resin and has a thickness of 10 μm. On the other hand, as a comparative example, an experiment was first conducted with a structure in which only the resin layer 13 made of polyethylene terephthalate (PET) and the adhesive layer 11 made of acrylic resin did not use the metal layer 14 . The guard band shrinks and cannot be measured. Therefore, in Comparative Example 1, only the resin layer 13 formed...

Embodiment 2～4 and comparative example 2）

[0077] Next, the present invention will be specifically described using Examples 2 to 4 and Comparative Example 2 of the protective tape 1 of the present embodiment.

Embodiment 2

[0078] Examples 2, 3, and Comparative Example 2 all have the same structure as the protective tape 1 of this embodiment, and only the thickness of the metal layer 14 is different. Specifically, the thickness of the metal layer 14 in Example 2 is 6 μm, the thickness of the metal layer 14 in Example 3 is 9 μm, and the thickness of the metal layer 14 in Comparative Example 2 is 0.1 μm. In addition, other thicknesses with such as Figure 4 Example 1 shown is the same. Furthermore, in Example 4, a metal layer 14 with a thickness of 9 μm is provided on the adhesive layer 11 , and a resin layer 13 made of polyimide (PI) with a thickness of 12 μm is laminated on the metal layer 14 . In the case of this Example 4, the tearing of the metal layer 14 when the protective tape 1 is peeled from the substrate is prevented by the resin layer 13 formed of polyimide (PI), and, since the resin layer 13 formed of polyimide (PI) PI) The resin layer 13 formed on the outermost layer of the protecti...

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Abstract

The present invention provides protective tape for protecting a substrate subjected to a solder reflow process, which ensures that the protective tape can be easily peeled away without any increase in adhesive force during the solder reflow process. The protective tape comprises an adhesive layer which is affixed to the substrate, a metallic layer and a resin layer. The metallic layer and the resin layer at least are provided on the adhesive layer.

Description

technical field [0001] The invention relates to a protection tape, which protects a substrate after a reflow soldering process. [0002] Background technique [0003] Conventionally, when connecting electronic components such as resistors, capacitors, and ICs to a substrate, first, solder is applied to the connection portion on the substrate, the electronic component is placed thereon, and a reflow process is performed. In the reflow soldering process, the solder is melted by heat, and then the solder is cooled and solidified, thereby connecting the connection portion on the substrate and the electronic component. [0004] Here, when the substrate is subjected to the above-mentioned reflow process, melted solder may scatter. At this time, scattered solder tends to adhere to other parts of the substrate than the connection portion to which the electronic components are connected, especially near the connection portion, causing electrical failure and degrading the appearance...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34B23K1/00B32B15/08C09J7/02C09J7/29
CPCH05K3/3494B23K1/20B32B27/308C09J2203/31B32B15/08B32B7/12H05K3/281C09J2400/163C09J2400/226B32B27/36C09J7/0296B32B15/20C09J7/29C09J7/28C09J7/22C09J7/40B23K1/0008C09J2301/16C09J2203/00
Inventor 筱原启彰
Owner TATSUTA ELECTRICWIRE & CABLE