Novel lead-free solder wire
A new type of lead-free soldering technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of low production efficiency, difficult continuous welding, easy oxidation and deterioration, etc., to prevent surface oxidation and ensure firmness high reliability and welding quality
Inactive Publication Date: 2013-12-04
KUNSHAN HONGJIA SOLDER MFG
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Problems solved by technology
Because the diameter of the solder wire is too small, the solder wire in the prior art is in the shape of an integrally extruded metal wire, and additional flux must be added during welding, resulting in uncontrollable solder residues, affecting the reliability of solder joints and improving production efficiency. Low, it is difficult to achieve continuous welding. At the same time, the surface of the solder wire has poor oxidation resistance and is easy to oxidize and deteriorate, which affects the welding quality and strength.
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[0013] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0014] see figure 1 , figure 1 It is a structural schematic diagram of a novel lead-free solder wire of the present invention.
[0015] The novel lead-free solder wire includes a solder flux layer 1, a tin layer 3 and an anti-oxidation layer 5, the tin layer 3 is coated on the surface of the solder flux layer 1, and the anti-oxidation layer 5 is evenly coated On the surface of the tin layer 3, the outer surface of the soldering flux layer 1 is provided with at least one semicircular convex surface 2, as a preferred solution, the number of the semicircular convex surfaces 2 is four, which is the s...
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Abstract
The invention relates to a novel lead-free solder wire, comprising a welding assisting layer, a tin layer and an anti-oxidation layer; the tin layer is wrapped on the face of the welding assisting layer; the anti-oxidation layer is uniformly coated on the face of the tin layer; at least one semicircular convex face is arranged at the outer face of the welding assisting layer; at least one interlayer is arranged in the tin layer. The face of the novel lead-free solder wire is not oxidative, the firmness of welding points is ensured, the welding assisting layer can be uniformly released due to the arrangement of the semicircular convex face, and the welding quality is high as the interlayer is arranged in the tin layer.
Description
technical field [0001] The invention relates to a novel lead-free solder wire. Background technique [0002] Solder is an important industrial raw material for connecting electronic components in welding lines, and is widely used in electronics industry, home appliance manufacturing, automobile manufacturing, maintenance industry and daily life. Solder wire is the most convenient solder for manual soldering of circuit boards. Solder wire can be divided into lead-free solder wire and lead solder wire according to its metal composition. Solder wire with different components has different melting points and uses. [0003] The main component of lead-free solder wire is tin, which is a lead-free tin alloy wire. Because the diameter of the solder wire is too small, the solder wire in the prior art is in the shape of an integrally extruded metal wire, and additional flux must be added during welding, resulting in uncontrollable solder residues, affecting the reliability of solder...
Claims
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IPC IPC(8): B23K35/14
Inventor 易升明
Owner KUNSHAN HONGJIA SOLDER MFG