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liquid backflow cooling led lamp

A technology of LED lamps and liquid reflow, which is applied in lighting and heating equipment, cooling/heating devices of lighting devices, decorative arts, etc., and can solve the problems of affecting light output efficiency, aging of fluorescent powder and silver glue of light sources, and inability to export heat in time and other problems, to achieve the effect of simple structure, obvious heat dissipation effect and low production cost

Inactive Publication Date: 2015-12-23
江苏宇融汇节能服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current integrated packaged LED light source is to package the chip on a small-area bracket, and the instantaneously accumulated heat cannot be exported in time. Long-term work will cause the phosphor and silver glue of the light source to age, thereby affecting the light output efficiency.

Method used

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  • liquid backflow cooling led lamp
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  • liquid backflow cooling led lamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] This embodiment is a liquid backflow heat dissipation LED bulb lamp, its structure is as attached figure 1 shown.

[0031] In this embodiment, the outer casing is a trumpet-shaped lamp holder 103, and the light-transmitting cover is a spherical light-transmitting cover 106. The small mouth end of the trumpet-shaped lamp holder is connected to a metal threaded lamp holder 101, and the trumpet-shaped lamp holder 103 has several ventilation holes 110. 102 is fixed in the trumpet-shaped lamp holder cavity close to the metal threaded lamp cap, and the circular LED light source board 109 is fixed on the big mouth end of the trumpet-shaped lamp holder. On the inner side of the circular LED light source board 109, a ring-shaped heat sink is arranged. The annular heat sink is configured such that an annular cover 108 is closed at the opening of the annular groove 107 to form a sealed annular cavity, and the cooling liquid 104 and volume compressible material particles 105 are fi...

Embodiment 2

[0035] This embodiment is a liquid backflow heat dissipation LED spotlight, its structure is as attached image 3 shown.

[0036] The outer shell of this embodiment is composed of a cylindrical lamp body 210 and a protective shell 201, the protective shell 201 is fixed at a port of the cylindrical lamp body, and the condenser 207 and the arc-shaped light-transmitting cover 209 are fixed at the end of the cylindrical lamp body. At the other port, the LED light source board 208 is fixed in the cylindrical lamp body 210. The LED light source board 208 divides the interior of the cylindrical lamp body 210 into a heat dissipation space and a light emitting space. The protective shell 201 is provided with through holes to make the heat dissipation space It communicates with the outside air, and the cylindrical heat sink is arranged in the heat dissipation space of the cylindrical lamp body. The cylindrical heat sink is structured as follows: The shaped upper cover 204 is inserted i...

Embodiment 3

[0040] This embodiment is a liquid backflow heat dissipation LED decorative lamp, its structure is as attached Figure 4 shown.

[0041] The outer shell of this embodiment is composed of a cylindrical lamp body 309 and an upper protective shell 301, the upper protective shell 301 is fixed on the upper port of the cylindrical lamp body 309, and the arc-shaped light-transmitting cover 305 is fixed on the cylindrical lamp body 309 At the lower port, the LED light source board 306 is fixed in the cylindrical lamp body 309, and close to the lower port, the LED light source board 306 divides the interior of the cylindrical lamp body into a heat dissipation space and a light emitting space, and the upper shell 301 is provided with a through hole, so that the heat dissipation space communicates with the outside air, and the cylindrical heat dissipation device is arranged in the heat dissipation space of the cylindrical lamp body. body 302, the cylindrical upper cover 302 is inserted ...

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Abstract

The invention relates to a liquid backflow heat dissipation LED lamp. The liquid backflow heat dissipation LED lamp is characterized in that a heat dissipation device is formed by a sealed heat dissipation cavity, cooling liquid and size compressible material particles, wherein the sealed heat dissipation cavity is filled with the cooling liquid and the size compressible material particles, a heat absorbing face of the sealed heat dissipation cavity is attached to the back face of an LED light source board tightly, and a heat dissipation face of the sealed heat dissipation cavity is exposed to air or connected with other heat dissipation bodies. According to the liquid backflow heat dissipation LED lamp, the heat dissipation device transmits the heat of the LED light source board to the other heat dissipation face of the sealed heat dissipation cavity through the backflow effect of the cooling liquid in the sealed heat dissipation cavity, and the heat is then dissipated to the air through heat dissipation modes such as convection, radiation and conduction. The size compressible material particles arranged in the cooling liquid effectively balance the pressure formed after the temperature of the cooling liquid rises. The liquid backflow heat dissipation LED lamp is simple in structure, low in production cost, long in service life and free of maintenance and provides a feasible solution for solving the heat dissipation problem of an LED light source and reducing manufacturing cost.

Description

technical field [0001] The invention relates to an LED lamp with a cooling device, in particular to an LED lamp using a liquid backflow cooling device. Background technique [0002] LED light source uses low-voltage power supply, low energy consumption, strong applicability, high stability, short response time, and can realize multi-color light emission. LED light source has been more and more widely used in the field of lighting, and has become a substitute for fluorescent lamps and incandescent lamps in the 21st century. The fourth generation of lighting sources. However, the current integrated packaged LED light source is that the chip is packaged on a small-area bracket, and the instantaneously accumulated heat cannot be exported in time. Long-term work will cause the phosphor and silver glue of the light source to age, thereby affecting the light output efficiency. LEDs must be below 80 degrees Celsius to have high luminous efficacy and long life. Therefore, the therma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V29/56F21S2/00F21W121/00F21W131/103F21Y101/02F21V29/502F21V29/83F21V29/87
Inventor 胡国祥吴起文
Owner 江苏宇融汇节能服务有限公司