Epoxy resin curing agent, and preparation method and application of epoxy resin curing agent

A technology of epoxy resin curing and compounding, applied in adhesive additives, non-polymer adhesive additives, coatings, etc., can solve the problems of poor compatibility of tougheners, affecting the safety and life of epoxy materials , to achieve the effects of low cost, good toughening effect and easy preparation

Active Publication Date: 2013-12-11
JIANGSU SOBUTE NEW MATERIALS +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy-based materials will become more and more brittle under low temperature conditions, which seriously affects the safety and life of epoxy materials under low temperature conditions.
Therefore, how to achieve low-temperature curing and high-efficiency toughening has becom

Method used

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  • Epoxy resin curing agent, and preparation method and application of epoxy resin curing agent
  • Epoxy resin curing agent, and preparation method and application of epoxy resin curing agent
  • Epoxy resin curing agent, and preparation method and application of epoxy resin curing agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The preparation of epoxy resin curing agent comprises the following steps:

[0022] (1) Measure and weigh polyamine and mercapto acid compounds according to a certain molar ratio, add polyamine into a flask equipped with stirring first, then add excess silica gel desiccant into reaction flask, heat up to 100°C, drop Add the mercapto acid compound, drop it within 30 minutes, raise the temperature to 160-200°C for 3-6 hours after the drop, remove the silica gel desiccant by filtration, and get the amidated mercapto-modified compound;

[0023] (2) After mixing the amidated mercapto-modified compound and amino polyether in a reaction kettle, stir at room temperature for 20-40 minutes to obtain the product.

[0024] Wherein, in step (1), the reaction conditions are shown in Table 1.

[0025] Table 1 Reaction conditions of step (1)

[0026]

[0027] Wherein, in step (2), the reaction conditions are shown in Table 2.

[0028] Table 2 Reaction conditions of step (2)

[0...

Embodiment 2

[0032] Preparation of cured epoxy resin:

[0033] Using the seven curing agents prepared in Example 1, the commercially available phenolic modified T31 curing agent (specially used for low-temperature curing in Changsha Chemical Industry), diethylenetriamine (DETA) and isophoronediamine (IPDA) were mixed with E51 epoxy The resin is mixed according to the optimal reaction ratio to prepare the cured epoxy resin.

[0034] The surface dry time, tensile strength, elongation, tensile elastic modulus and steel-steel tensile shear strength under low temperature conditions were tested respectively.

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Abstract

The invention provides an epoxy resin curing agent which is prepared by polyamine, a mercaptan acid compound and amino polyether. The invention further provides a preparation method and an application of the epoxy resin curing agent. The epoxy resin curing agent is simple in preparation method and low in cost, and has the advantages of low-temperature curing, good toughening effect, simplicity in preparation, environmental protection and the like.

Description

technical field [0001] The invention belongs to the field of building materials, and particularly relates to an epoxy resin curing agent suitable for low temperature and good toughening effect and a preparation method thereof, and also relates to the application of the curing agent in preparing epoxy resin cured products. Background technique [0002] Cured epoxy resin has the characteristics of strong adhesion, can be cured at room temperature, small curing shrinkage, high mechanical properties and excellent corrosion resistance, so it is widely used in construction, machinery, electronics, etc. as adhesives, coatings, and grouting materials. and many other fields. However, the two disadvantages of low-temperature curing and high brittleness of epoxy resin materials have become the biggest problems restricting the application of epoxy resin materials. [0003] In the existing application of cured epoxy resin, the method of adding a curing accelerator is usually used to rea...

Claims

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Application Information

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IPC IPC(8): C08G59/66C08G59/56C09D7/12C09J11/06
Inventor 冉千平乔敏俞寅辉高南箫尹浩刘加平
Owner JIANGSU SOBUTE NEW MATERIALS
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