319results about How to "Reduce crosslink density" patented technology

The invention is a radiation curable coating containing an antimicrobial agent, where upon irradiation with UV light, the radiation curable coating rapidly cures to a polymeric coating. The polymeric coating has durable antimicrobial properties, being especially effective at preventing the growth of Staphylococcus aureaus and Kleibsella pneunoniae on wood flooring and furniture. The major components in the radiation curable coating are a urethane acrylic oligomer, a radiation cure package, an antimicrobial agent, a cross-linking agent, and optionally, an additive package. The radiation curable urethane oligomer is a relatively short chain backbone urethane polymer that is end capped with a radiation curable moiety, where the moiety is an acrylic. The cross-linking agent is one or more monomers used to lower the viscosity and promote cross-linking, and include acrylate esters of mono-, di-, tri-, or tetrafunctional alcohols. The radiation cure package contains at least one photoinitiator.

The crosslinker of the invention is an asymmetrical polyvinyl crosslinker that disassociates at elevated temperature, and is especially useful in the preparation of superabsorbent polymers.

Described are mono- and bi-layer alginate post-surgical anti-adhesion barriers with tailored absorption profiles and non-migrating characteristics. Muco-adhesive properties of alginates in their solid state are used to localize the device, and lubricious properties of alginates in their liquid state are used to mitigate adhesion formation during wound healing. In addition, the design of the implant can be selected such that the crosslinking agent is released from the device under specific conditions and the absorbance profile modified. A medicinal agent may optionally be incorporated.

The present invention is directed to two component coating compositions that cure under ambient conditions and more particularly to those having low VOC (volatile organic content) that are suitable for use in automotive refinish and Original Equipment Manufacturing (OEM) applications. The coating composition includes crosslinkable and crosslinking components, wherein the crosslinkable component includes a low polydispersity, low molecular weight copolymer having on an average 2 to 25 functional groups, such as hydroxyl, carboxyl, acetoacetoxy, primary and secondary amine, and epoxy. The copolymer is polymerized from a monomer mixture that includes one or more non-functional acrylate monomers and one or more functional methacrylate monomers provided with the functional groups. The crosslinking component includes polyisocyanate, polyamine, ketimine, melamine, epoxy, polyacid or a combination thereof. The invention is also directed to coating produced from the coating composition.

The present invention provides a curing agent for epoxy resin containing a siloxane-modified phenol resin (3) obtained by dealcoholization condensation reaction between a phenol resin (1) and a hydrolyzable alkoxysilane (2). The present invention further provides an epoxy resin composition comprising an epoxy resin and the above-mentioned curing agent for epoxy resin. The present invention further provides a method for preparing a siloxane-modified phenol resin (3) characterized by subjecting a phenol resin (1) and a hydrolyzable alkoxysilane (2) to dealcoholization condensation reaction.

A heat-insulating layer exhibiting high resistance to cracks, peeling, deformation, and gasoline and high heat insulation is obtained on the wall surface of an engine member (19). First, a heat insulator layer including a silicone-based resin and hollow particles containing a Si-based oxide is formed on a wall surface of the engine member (19). Then, Si-based oxide is produced through oxidation of a silicone-based resin in at least part of the surface of the heat insulator layer by heating the surface of the heat insulator layer. Thereafter, a catalytic metal is added to the silicone-based resin in the surface of the heat insulator layer and/or Si-based oxide derived from the hollow particles. Using the catalytic metal as nuclei, electroless plating is performed. In this manner, a heat-insulating layer (21) in which the surface of the heat-insulating film (27) is covered with a plating film (29) is obtained.

The present invention aims to provide an electronic component capable of reducing the occurrence of cracks at the joining portion to a board etc. A capacitor 1 (laminated ceramic capacitor) being one example of the electronic component is provided with an element assembly 10 (ceramic) and a pair of external electrodes 20 formed on both side surfaces of the element assembly 10. In the element assembly 10, a dielectric layer 12 and an internal electrode 14 are laminated alternately. The external electrode 20 has such constitution that a first electrode layer connected with the internal electrode, a second electrode layer (electroconductive resin layer) including a hardened product of thermohardening resin containing a polyphenol compound having a side chain composed of an aliphatic group, a third electrode layer composed of Ni and a fourth electrode layer composed of Sn are formed in this order from the element assembly side.

The invention relates to a flip chip bottom filling adhesive with normal temperature rapid capillary flowing property and rapid repairability. The flip chip bottom filling adhesive is prepared from the following raw materials in percentage by weight: 10-60% of epoxy resin, 10-20% of polyether modified epoxy resin, 5-20% of bismaleimide modified toughening resin, 5-20% of furan alkyl glycidyl ether, 5-30% of a curing agent, 5-20% of a curing accelerator, 0.5-3% of a coupling agent, 0-40% of spherical silica powder and 0-6% of pigments. The bottom filling adhesive provided by the invention is mainly applied to bottom filling of flip chips so as to improve the connection reliability and has the characteristics of high Tg, good normal-temperature rapid flowing property, good connection reliability and good rapid curing property.

The invention provides highly resilient synthetic hydrogels, which can be prepared, for example, by using the efficient thiol-norbornene chemistry to cross-link hydrophilic poly(ethylene glycol) (PEG) and hydrophobic polydimethylsiloxane (PDMS) polymer chains. The simple hydrogel system with enhanced mechanical properties is useful in many applications, including in the biomedical field and in the design of protective and corrective wear.

The invention discloses an organic silicane high-adsorbing resin, which is copolymerized by soluble polycondensation product and vinyl monomer free radical with the content of organic silica as 0.1-5wt% as vinyl monomer, wherein the organic silicane is represented through Y (CH2) nSiX3 (Y is vinyl, epoxy radical, mercapto radical and so on; X is methoxyl, ethyoxyl, isopropoxy and so on); the resin adsorbs deionized water and salt water, which displays optical, heat and ultraviolet stability in the agricultural and hygiene domain.

The present invention relates to an electrophotographic photoreceptor comprising a conductive support having formed thereon a specific photosensitive layer. The photosensitive layer comprises a siloxane resin-containing layer containing a siloxane resin having a structural unit represented by general formula (1) shown below, a structural unit represented by general formula (2) shown below, and an organic group derived from a compound having hole transport capability, or comprises a siloxane resin-containing layer containing a siloxane resin obtained by using an organic silicon compound having a structural unit represented by general formula (1) shown below and a hydrolytic group, and a compound represented by general formula (3) shown below: The formulas are defined in the specification.

The invention relates to filling glue and a preparation method thereof, in particular to high-reliability fast-curing filling glue. The high-reliability fast-curing filling glue is prepared from the following raw materials in percentage by weight: 10-50% of epoxy resin, 5-20% of an epoxy diluent, 5-15% of epoxy resin with capability of free radical reaction, 0-10% of an olefin monomer with capability of free radical reaction, 5-20% of a toughener, 0.5-3% of a coupling agent, 0.1-5% of a cationic initiator, 0.1-5% of a radical initiator, 0-5% of filler and 0-5% of pigment. The bottom filling glue provided by the invention can fast cure, has a high glass-transition temperature (Tg), a low expansion coefficient and good repair property, and can be mainly used for flip chip bottom filling to improve the connection reliability.

The invention discloses polysiloxane modified epoxy resin and a preparation method thereof. The preparation method comprises the following steps: firstly mixing and dissolving epoxy resin and polysiloxane in an organic solvent, dropwise adding a catalyst at a temperature of 60-100 DEG C in a nitrogen environment, then carrying out stirring for reacting to obtain polysiloxane modified epoxy resin,removing unreacted polysiloxane after the reaction is finished, and carrying out reduced-pressure distillation to remove the organic solvent to obtain the pure modified resin. The polysiloxane modified epoxy resin prepared by the invention can be cured into a film at room temperature, the obtained coating has good flexibility and impact resistance, the ultraviolet aging resistance is remarkably improved, and the service life is greatly prolonged. In addition, the process is simple, and energy consumption is low.