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Fire-proof and thermal-insulation board and manufacturing method thereof

A fireproof insulation board and a manufacturing method technology, which are applied in the directions of thermal insulation, fire prevention, building thermal insulation materials, etc., can solve the problems of inconvenient transportation, installation, poor thermal insulation performance, etc. impactful effect

Inactive Publication Date: 2012-11-21
万国骅
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sound insulation board is made by pressing and forming at room temperature in a high-frequency vibrating machine, with a density of 300-2000kg / m3, which is not only inconvenient for transportation and installation, but also has poor thermal insulation performance.

Method used

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  • Fire-proof and thermal-insulation board and manufacturing method thereof

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Effect test

Embodiment 1

[0021] The specific steps of the fireproof insulation board of the present embodiment and its manufacturing method are as follows (see figure 1 ):

[0022] The first step, material preparation—prepare the modified phenolic resin with a weight ratio of 1:0.01:0.8, polypropylene fiber and vitrified microbeads, the modified phenolic resin is outsourced or produced by itself, the self-made method is detailed in the Chinese patent of 200910226671.9 Application documents, polypropylene fiber was purchased from Wuhan Zhongding Development Co., Ltd., with a length of 6 mm; vitrified microbeads were purchased from Fuxin Environmental Protection Thermal Insulation Material Factory in Pingqiao District, Ziyang City, and the main component is SiO 2 and AI 2 o 3 , Irregular balls with a hollow closed-cell structure with a particle diameter of 0.15-1.5mm.

[0023] Second step, adhesive agent---adding its weight percentage successively in modified phenolic resin is 4% tensio-active agent-...

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Abstract

The invention relates to a fire-proof and thermal-insulation board and a manufacturing method thereof, and belongs to the technical field of constructional materials. According to the manufacturing method of the fire-proof and thermal-insulation board, modified phenolic resin, reinforcing fibers and inorganic micro bead thermal insulation fillings with the weight ratio of 1:(0-0.05):(0.3-1) are prepared; and after the steps of preparing adhesive, preparing a mixture, foaming, forming and solidifying to form are finished, a foam board is subjected to thermal insulation to be formed, so that the fire-proof and thermal-insulation board in a closed cell foamed structure is obtained. According to manufacturing method, organic materials and inorganic materials are organically combined, so that a novel fire-proof and thermal-insulation material with the fire-proof property of the inorganic thermal insulation materials and the thermal-insulation property of the organic thermal insulation materials is manufactured; and the fire-proof and thermal-insulation board is simple in forming technology, and can practically satisfy the energy saving and safety requirements of wall construction.

Description

technical field [0001] The invention relates to a board, especially a fireproof and heat-preserving board, and also relates to a manufacturing method thereof, which belongs to the technical field of building materials. Background technique [0002] With the deteriorating environment and rising energy costs in today's world, reducing energy consumption and reducing greenhouse gas emissions has become a hot spot of great concern in the world. In order to effectively reduce building energy consumption and achieve the overall goal of building energy saving of 65%, the use of building insulation materials has become an important measure for building energy saving and consumption reduction. [0003] According to the applicant's knowledge, most of the energy-saving insulation materials for building walls in my country currently use expanded polystyrene foam (EPS), extruded polystyrene foam clinker (XPS), polyurethane foam (PU), phenolic foam Organic materials such as (PF) and inorg...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04B1/90E04B1/94E04B1/64E04B1/66B29C44/02C08L61/14C08K7/26C08K7/20C08K7/14C08J9/14
Inventor 万国骅
Owner 万国骅
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