High-performance silicon-based heat conduction mud and preparation method thereof

Abstract

The invention relates to high-performance silicon-based heat conduction mud and a preparation method thereof. The silicon-based heat conduction mud is prepared from the following raw materials in parts by weight: 100 parts of vinyl silicone oil, 1-25 parts of a cross-linking agent, 10-80 parts of a chain extender, 0.001-0.1 part of an inhibitor, 0.1-5 parts of a catalyst and 800-1500 parts of a heat conduction powder filler, wherein the vinyl silicone oil is composed of single-ended vinyl silicone oil, double-ended vinyl silicone oil and lateral vinyl silicone oil; the cross-linking agent is lateral hydrogen silicone oil; and the chain extender is terminal hydrogen silicone oil. The silicon-based heat conduction mud has the advantages of no oil seepage, no powder falling, no elasticity, moderate viscosity, moderate elongation at break, high heat conduction coefficient and excellent comprehensive performance, and can meet the personalized construction conditions and requirements of different electronic devices.

Description

technical field [0001] The invention relates to the field of silicone heat-conducting materials, in particular to a high-performance silicon-based heat-conducting putty and a preparation method thereof. Background technique [0002] With the advent of the 5G era, everything will be interconnected. Various electronic devices are the basis for this interoperability. In the future, the energy consumption of electronic devices will become higher and higher, and the heat emitted will increase sharply. Conduction will directly damage the electronic equipment itself, which puts forward higher requirements for thermally conductive materials. The current thermally conductive materials not only require high thermal conductivity, but also meet the individualized construction conditions of different electronic devices. The silicone material has outstanding stability at high and low temperatures, and it is an excellent heat-conducting material after being mixed with heat-conducting powde...

AI Technical Summary

Problems solved by technology

Thermally conductive silicone grease is used as a thermally conductive material. Since it does not solidify, the separation of grease and fillers will cause oil leakage after a long time. For example, patent CN104893296A discloses a method for preparing thermally conductive silicone grease mixed with silicone oil and graphene. The thermally conductive silicone grease is long There is a risk of separation between graphene and silicone gel if left for a long time; due to the cross-linking reaction between the thermally conductive gel and the gasket, there will be no oil leakage problem, and the thermal conductivity is excellent. For example, the patent CN106700558A introduces a high-performance thermally conductive gel. However, because the thermal conductive gel is fluid before curing, it needs to be molded. Once formed, the shape cannot be changed. In some special electronic devices, it is difficult to construct; and the thermal conductive gel itself is plastic, after curing. It can still change shape according to construction conditions, can meet individual construction needs, and can be used in various electronic devices and LED lamp tubes

[0004] At present, there are relatively few researches on silicon-based heat-conducting putty in China. The heat-conducting putty on the market often has the following problems: easy to seep oil, easy to drop powder; high viscosity, when it is necessary to separate the heat-conducting putty, it is difficult to remove it from the substrate. Residues on the electronic parts and even condensation damage, which will eventually lead to a decrease in the yield of the product; it is elastic, and it will be stressed when the heat-conducting mud is applied on the electronic parts. If the heat-conducting mud is not purely plastic and has rebound, then after construction, It will rebound and deform, which will affect the thermal conductivity and even fall off; the elongation at break is high, and it will produce wire drawing when it is stressed, which is not good for construction

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