Flip chip bottom filling adhesive with normal temperature rapid capillary fluidity and rapid repairability

Abstract

The invention relates to a flip chip bottom filling adhesive with normal temperature rapid capillary flowing property and rapid repairability. The flip chip bottom filling adhesive is prepared from the following raw materials in percentage by weight: 10-60% of epoxy resin, 10-20% of polyether modified epoxy resin, 5-20% of bismaleimide modified toughening resin, 5-20% of furan alkyl glycidyl ether, 5-30% of a curing agent, 5-20% of a curing accelerator, 0.5-3% of a coupling agent, 0-40% of spherical silica powder and 0-6% of pigments. The bottom filling adhesive provided by the invention is mainly applied to bottom filling of flip chips so as to improve the connection reliability and has the characteristics of high Tg, good normal-temperature rapid flowing property, good connection reliability and good rapid curing property.

Description

technical field [0001] The invention relates to a flip-chip bottom filler and a preparation method thereof, in particular to a flip-chip bottom filler with fast capillary fluidity at room temperature and rapid repairability. Background technique [0002] In the current world, due to the demand for wireless communications, portable computers, broadband Internet products and car navigation electronic products, the integration of electronic components is getting higher and higher, the chip area is expanding, and the number of integrated circuit pins is increasing. The package size is further miniaturized and miniaturized, and integrated circuits are developing in a lighter, thinner, and smaller direction, so many new packaging technologies and packaging forms have emerged. Flip chip (flip chip) interconnection technology is one of the most important packaging technologies. Flip chip technology connects IC chips and printed wiring substrates through small and thin solder bumps. ...

AI Technical Summary

Problems solved by technology

At present, conventional underfills are difficult to repair and remove, especially when thinner circuit boards are used. Due to their weaker thermal damage resistance, they are more likely to be scrapped.

Due to the poor rework efficiency of the existing operations, in order to improve the rework efficiency, most of the research results are to add plasticizers, etc.

However, it will cause some problems, such as the reduction of the connection reliability and the weakening of the curability caused by the reduction of the glass transition temperature (Tg) during thermal cycle processing, and it is difficult to meet the increasingly stringent use conditions of electronic products. requirements

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