Flip chip bottom filling adhesive with normal temperature rapid capillary fluidity and rapid repairability

An underfill, flip-chip technology, applied in adhesives, epoxy resins, rubber-derived adhesives, etc., can solve the problems of reduced connection reliability, difficulty in repairing and removing glue, poor rework efficiency, etc. Laminide toughness, good connection reliability, and the effect of increasing connection reliability

Active Publication Date: 2015-07-01
王传广 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, conventional underfills are difficult to repair and remove, especially when thinner circuit boards are used. Due to their weaker thermal damage resistance, they are more likely to be scrapped.
Due to the poor rework efficiency of the existing operations, in order to improve the rework efficiency, most of the research results are to a...

Method used

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  • Flip chip bottom filling adhesive with normal temperature rapid capillary fluidity and rapid repairability
  • Flip chip bottom filling adhesive with normal temperature rapid capillary fluidity and rapid repairability
  • Flip chip bottom filling adhesive with normal temperature rapid capillary fluidity and rapid repairability

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] The raw material components and dosages of the underfill provided in Examples 1-5 and Comparative Examples 1-2 are shown in Table 1 below.

[0041] In an embodiment, in order to obtain representative data, bisphenol A type epoxy resin is selected E51 (embodiment 1,5, comparative example 1,2), E54 (embodiment 4); Novolak epoxy resin is selected F51 (implementation) Example 3), F44 (embodiment 4), the aliphatic epoxy resin is selected Dow DER 736 (embodiment 2), but the present invention is not limited thereto.

[0042] Preparation:

[0043]1. Take the epoxy resin, polyether-modified epoxy resin, bismaleimide-modified polysiloxane, furanyl group by weighing the weight percentage of each raw material in Table 1 accounting for the total weight of the raw material. Put glycidyl ether, coupling agent, and pigment into the reaction kettle, stir and mix;

[0044] 2. Weigh the spherical silicon micropowder, add it into the reaction kettle of step 1 at intervals in batches, and...

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PUM

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Abstract

The invention relates to a flip chip bottom filling adhesive with normal temperature rapid capillary flowing property and rapid repairability. The flip chip bottom filling adhesive is prepared from the following raw materials in percentage by weight: 10-60% of epoxy resin, 10-20% of polyether modified epoxy resin, 5-20% of bismaleimide modified toughening resin, 5-20% of furan alkyl glycidyl ether, 5-30% of a curing agent, 5-20% of a curing accelerator, 0.5-3% of a coupling agent, 0-40% of spherical silica powder and 0-6% of pigments. The bottom filling adhesive provided by the invention is mainly applied to bottom filling of flip chips so as to improve the connection reliability and has the characteristics of high Tg, good normal-temperature rapid flowing property, good connection reliability and good rapid curing property.

Description

technical field [0001] The invention relates to a flip-chip bottom filler and a preparation method thereof, in particular to a flip-chip bottom filler with fast capillary fluidity at room temperature and rapid repairability. Background technique [0002] In the current world, due to the demand for wireless communications, portable computers, broadband Internet products and car navigation electronic products, the integration of electronic components is getting higher and higher, the chip area is expanding, and the number of integrated circuit pins is increasing. The package size is further miniaturized and miniaturized, and integrated circuits are developing in a lighter, thinner, and smaller direction, so many new packaging technologies and packaging forms have emerged. Flip chip (flip chip) interconnection technology is one of the most important packaging technologies. Flip chip technology connects IC chips and printed wiring substrates through small and thin solder bumps. ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J183/04C09J115/00C09J11/04C09J11/06C08G77/388C08C19/28
CPCY02P20/582
Inventor 王传广徐杰
Owner 王传广
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