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Double-layer electromagnetic shielding film and preparation method thereof

An electromagnetic shielding film and double-layer technology, which is applied in the field of double-layer electromagnetic shielding film and its preparation, can solve the problems of reduced shielding performance, impossibility to meet the requirements of FPC high shielding performance, and no ductility of the metal layer.

Active Publication Date: 2019-01-04
SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the electromagnetic shielding film has the following problems: (1) the insulating layer of the electromagnetic shielding film adopts ink, because the ink molecular weight is low, the filler ratio is high, and the crosslinking density is large, the ink is printed on the common carrier film, and the volume of the curing reaction Large shrinkage, due to the brittle and hard characteristics of the ink itself, will cause the electromagnetic shielding film produced with ink to be hard and brittle, and not resistant to bending; used in the FPC industry, resulting in the flexibility and bending resistance of the electromagnetic shielding film Poor stability and product flatness; when the carrier film is torn off, the ink is easy to adhere to the carrier film; the ink itself is relatively brittle and prone to micro-cracks, resulting in the infiltration of the liquid medicine during the subsequent processing of the FPC, resulting in the product being scrapped
(2) The shielding layer of the electromagnetic shielding film adopts a metal shielding layer to improve the shielding effect. Usually, the method of vacuum sputtering or electroplating is used to form a metal layer on the insulating layer. The thickness of the metal layer formed by this method is limited and the efficiency is low. And The electroplated metal layer is easy to produce columnar crystals, which makes the metal layer not ductile. In the subsequent complex high-temperature and high-pressure operation process of FPC, it is prone to cracks, oxidation, etc., which will reduce the shielding performance or even lose the shielding performance. At the same time In the subsequent reflow soldering process, it is easy to foam and delaminate, which cannot meet the requirements of FPC for flexibility, high temperature and high pressure resistance, and liquid impact resistance.
(3) The shielding performance of the shielding film made of ordinary conductive adhesive is difficult to reach 60dB. With the development of information technology and the commercial application of 5G communication, the shielding performance of FPC is often required to be greater than 60dB, or even 80dB. The ordinary shielding film has been completely Impossible to meet the requirements of the FPC industry for high shielding performance

Method used

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  • Double-layer electromagnetic shielding film and preparation method thereof
  • Double-layer electromagnetic shielding film and preparation method thereof
  • Double-layer electromagnetic shielding film and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0082] The electromagnetic wave shielding layer of the present invention is a reflective shielding coating, and the first insulating paint layer, the second insulating paint layer, and the coating of the reflective shielding coating use acrylic paint, and the manufacturing process that the double-layer electromagnetic shielding film can adopt is as follows.

[0083] The first step is to prepare the first insulating coating layer, the second insulating coating layer, the coating of the reflective shielding coating and the material of the metal layer, which can be prepared in the following order, but the scope of protection is not limited to the following A1, A2, A3, A4 order of.

[0084] A1, preparing the first insulating coating layer coating;

[0085] (1) Get 7 parts of acrylic acid, 20 parts of methyl acrylate, 45 parts of acrylonitrile, 20 parts of butyl acrylate, and 7 parts of isobornyl acrylate to obtain acrylic resin I through emulsion (or solution polymerization, bulk po...

Embodiment 2

[0106] The manufacturing process of the double-layer electromagnetic shielding film of this embodiment is basically the same as that of Example 1, except that the combination of the first insulating coating layer coating in A1, the second insulating coating coating coating in A2, and the reflective shielding coating coating in A3 Divide and match ratio:

[0107] The proportioning of each raw material that makes acrylic resin I in A1 is different, and the addition amount of acrylic acid, methyl acrylate, acrylonitrile, butyl acrylate, and isobornyl acrylate are respectively 3, 10, 30, 10, 5 parts; The amounts of pigment carbon black, titanium dioxide and silicon oxide added to the acrylic resin I were 10%, 3%, and 5% respectively.

[0108] The ratio of each raw material that makes acrylic resin II in A2 is different, and the addition amount of acrylic acid, ethyl acrylate, butyl methacrylate, acrylonitrile is respectively 2, 10, 30, 5 parts; The amount of elastic microspheres ...

Embodiment 3

[0113] The manufacturing process of the double-layer electromagnetic shielding film of this embodiment is basically the same as that of Example 1, except that the combination of the first insulating coating layer coating in A1, the second insulating coating coating coating in A2, and the reflective shielding coating coating in A3 Distribution ratio:

[0114] The ratios of the raw materials for the acrylic resin I obtained in A1 are different, and the additions of acrylic acid, methyl acrylate, acrylonitrile, butyl acrylate, and isobornyl acrylate are respectively 10, 30, 60, 30, and 10 parts; The amounts of pigment carbon black, titanium dioxide and silicon oxide added to the acrylic resin I were 20%, 10%, and 15% respectively.

[0115] The ratios of raw materials for the acrylic resin II obtained in A2 are different, and the addition amounts of acrylic acid, ethyl acrylate, butyl methacrylate, and acrylonitrile are respectively 5, 40, 60, and 10 parts; The amount of elastic ...

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Abstract

The invention discloses double-layer electromagnetic shielding film. The shielding film comprises carrier film, a first insulating coating layer coated on the barrier film, a second insulating coatinglayer coated on the first insulating coating layer, a metal layer compounded on the metal layer, an electromagnetic wave shielding coating layer coated on the metal layer and release type protectivefilm arranged on the electromagnetic wave shielding coating layer; the carrier film is matt release film; coating of the first insulating coating layer is wear-resisting acrylate coating or polyurethane coating, the abrasive resistance performance is greater than 1000 times, and the thickness is 1-2 microns; coating of the second insulating coating layer is high-filling high-toughness acrylate coating or polyurethane coating or rubber coating, the number of bending resistance times is greater than 80000, and the thickness is 2-7 microns; the metal layer is thin film prepared from rolled metalfoils, and the thickness of the metal layer is 3-9 microns. The film has better toughness, bending resistance performance and product smoothness and a better shielding effect.

Description

technical field [0001] The invention relates to the technical field of electromagnetic shielding, in particular to a double-layer electromagnetic shielding film and a preparation method thereof. Background technique [0002] In the flexible printed circuit board (FPC) industry, with the upgrading of electronic devices such as smart phones and Ipads, the requirements for electromagnetic shielding are also getting higher and higher. Due to the processing technology and use requirements of FPC, the electromagnetic shielding film used on FPC must meet the following requirements: high temperature resistance (180°C, several hours, 270°C, short time), high pressure (12MPa), flexibility and bending resistance, 1000h constant temperature Constant humidity (85℃ temperature, 85% humidity), chemical resistance (acid, alkali, organic solvent), ultrasonic cleaning resistance. [0003] In the prior art, the electromagnetic shielding film has the following problems: (1) the insulating laye...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/20B32B7/06B32B15/00B32B33/00C09D5/25C09D5/33C09D5/32
CPCC09D5/00C09D5/004C09D5/32B32B7/06B32B15/00B32B15/20B32B33/00B32B2255/26B32B2255/10B32B2255/06B32B2307/558B32B2307/554B32B2307/546B32B2307/306B32B2307/212
Inventor 刘仁成谢文波王绍亮洪腾万彩兵
Owner SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD
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