Double-layer electromagnetic shielding film and preparation method thereof

An electromagnetic shielding film and double-layer technology, which is applied in the field of double-layer electromagnetic shielding film and its preparation, can solve the problems of reduced shielding performance, impossibility to meet the requirements of FPC high shielding performance, and no ductility of the metal layer.
CN109130383AActive Publication Date: 2019-01-04SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD
Publication Date
2019-01-04

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Abstract

The invention discloses double-layer electromagnetic shielding film. The shielding film comprises carrier film, a first insulating coating layer coated on the barrier film, a second insulating coatinglayer coated on the first insulating coating layer, a metal layer compounded on the metal layer, an electromagnetic wave shielding coating layer coated on the metal layer and release type protectivefilm arranged on the electromagnetic wave shielding coating layer; the carrier film is matt release film; coating of the first insulating coating layer is wear-resisting acrylate coating or polyurethane coating, the abrasive resistance performance is greater than 1000 times, and the thickness is 1-2 microns; coating of the second insulating coating layer is high-filling high-toughness acrylate coating or polyurethane coating or rubber coating, the number of bending resistance times is greater than 80000, and the thickness is 2-7 microns; the metal layer is thin film prepared from rolled metalfoils, and the thickness of the metal layer is 3-9 microns. The film has better toughness, bending resistance performance and product smoothness and a better shielding effect.
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Description

technical field

[0001] The invention relates to the technical field of electromagnetic shielding, in particular to a double-layer electromagnetic shielding film and a preparation method thereof. Background technique

[0002] In the flexible printed circuit board (FPC) industry, with the upgrading of electronic devices such as smart phones and Ipads, the requirements for electromagnetic shielding are also getting higher and higher. Due to the processing technology and use requirements of FPC, the electromagnetic shielding film used on FPC must meet the following requirements: high temperature resistance (180°C, several hours, 270°C, short time), high pressure (12MPa), flexibility and bending resistance, 1000h constant temperature Constant humidity (85℃ temperature, 85% humidity), chemical resistance (acid, alkali, organic solvent), ultrasonic cleaning resistance.

[0003] In the prior art, the electromagnetic shielding film has the following problems: (1) the insulating laye...

Claims

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