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Fatty acid modified epoxy resin and preparation method thereof

A fatty acid modification, epoxy resin technology, applied in epoxy resin coatings, coatings, anti-corrosion coatings, etc., can solve the problems of high brittleness, easy cracking, and poor gloss of the coating film, and improve the toughness of the coating film. , the effect of improving adhesion

Active Publication Date: 2013-05-01
EPOXY BASE ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Epoxy resin with low molecular weight has high crosslinking density when cured, and the coating film is brittle and easy to crack. The toughness of coating film can be improved by using high molecular weight polyamide curing agent, but the compatibility between high molecular weight polyamide and epoxy is poor, and the coating film has less luster. Improving the compatibility of epoxy resins and polymer polyamides has become a recent research hotspot

Method used

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  • Fatty acid modified epoxy resin and preparation method thereof
  • Fatty acid modified epoxy resin and preparation method thereof
  • Fatty acid modified epoxy resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Put 70 parts by weight of liquid epoxy resin and 7 parts by weight of dimer acid into a four-port glass reaction tank equipped with a thermometer, a stirring device, a nitrogen gas injection pipe, and a heating device, stir evenly and rise from normal temperature to 80°C , add a catalyst amount of dimethylimidazole, raise the temperature to 150°C for 2 hours, take a sample to test the epoxy equivalent, stop heating when the tested epoxy equivalent value reaches 200-280g / eq, and add solvent when the temperature is lower than 90°C Dissolved into a fatty acid modified epoxy resin solution with a solid content of 90%.

Embodiment 2

[0028] In the same reaction device as in Example 1, 75 parts by weight of liquid bisphenol A epoxy resin and 10 parts by weight of dimer acid were respectively added, stirred evenly and raised from normal temperature to 85°C, and a catalyst amount of 2-ethyl -4-Methylimidazole, heat up to 155°C and keep the temperature for 2 hours, take a sample to test the epoxy equivalent, when the tested epoxy equivalent value reaches 200-280g / eq, stop heating, when the temperature is lower than 90°C, add xylene solution to dissolve A fatty acid modified epoxy resin solution with a solid content of 90%.

Embodiment 3

[0030] In the reaction device identical with embodiment 1, drop into the liquid bisphenol A epoxy resin of 60 weight parts, the dimer acid of 5 weight parts respectively, stir evenly and rise to 90 ℃ by normal temperature, add the tetramethyl chloride of catalyst amount ammonium chloride, heat up to 160°C and keep the temperature for 2.5h, take samples to test the epoxy equivalent, when the tested epoxy equivalent value reaches 200-280g / eq, stop heating, when the temperature is lower than 90°C, add acetone solution to dissolve to a solid content of 90% fatty acid modified epoxy resin solution.

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Abstract

The invention discloses a fatty acid modified epoxy resin and a preparation method thereof. Through uniformly mixing a liquid difunctional epoxy resin and fatty acid, reacting the liquid difunctional epoxy resin with the fatty acid under a condition with a catalyst and adding a fatty acid flexible chain segment to a low molecular weight liquid epoxy resin molecule, the cross-linking density of the obtained fatty acid modified epoxy resin after being cured is reduced, so that the toughness of a film is improved, the adhesion force of the film to a metal substrate is increased and the reaction activity of the film is not reduced; the fatty acid modified epoxy resin can be cured at a normal temperature, so that construction requirements of various heavy anti-corrosion coatings are satisfied.

Description

technical field [0001] The invention relates to the field of epoxy resins, in particular to a fatty acid modified epoxy resin and a preparation method thereof. Background technique [0002] Epoxy resins generally refer to organic polymer compounds containing two or more epoxy groups in the molecule. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can undergo cross-linking reactions with various types of curing agents to form insoluble, infusible high polymers with a three-dimensional network structure. Epoxy resin has many advantages, such as high mechanical strength, strong cohesive force, low shrinkage rate, good stability, excellent processing performance, etc., and is widely used in coatings, adhesives, electrical products, civil engineering, Xiahe materials...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/14C09D163/00C09D5/08
Inventor 林新冠林仁宗
Owner EPOXY BASE ELECTRONICS MATERIAL
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