High-temperature hard solder quasi-continuous semiconductor laser bar stack encapsulating method

A packaging method and hard solder technology, applied in the laser field, can solve the problems of easy cracking of bars and laser failure, etc., and achieve the effect of short cycle time and improved service life
CN103457151AActive Publication Date: 2013-12-18SUZHOU INST OF BIOMEDICAL ENG & TECH CHINESE ACADEMY OF SCI
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
SUZHOU INST OF BIOMEDICAL ENG & TECH CHINESE ACADEMY OF SCI
Publication Date
2013-12-18

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Abstract

The invention discloses a high-temperature hard solder quasi-continuous semiconductor laser bar stack encapsulating method. n bars, n+1 conductive cooling partition blocks and n+1 electric-insulating cooling fins are stacked alternately and welded in a reflowing mode at one time through high-temperature hard solder with a special tool clamp to form a laser bar stack unit, and then the laser bar stack unit and a heat sink are welded in a reflowing mode again through soft solder with relatively low temperature. The method can obviously reduce welding stress in the high-temperature hard solder quasi-continuous semiconductor laser bar stack encapsulating process, prolong the service life of devices and improve the output rate and the photoelectric performance.
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Description

technical field

[0001] The invention relates to the field of laser technology, in particular to a bar-stack packaging method for high-temperature hard solder quasi-continuous semiconductor lasers. Background technique

[0002] Due to its small size, light weight, and high electro-optical conversion efficiency, semiconductor lasers are widely used in industries, medical care, communications, military defense and other fields. The application market has higher and higher requirements for high power, especially the peak power of quasi-continuous output, and the high-power vertical stack and area array assembled by multiple bars have developed rapidly.

[0003] At present, the high-power vertical stacks assembled by multiple bars are mainly stacked with single-bar semiconductor lasers packaged in micro-channel heat sinks. The micro-channel heat sink uses deionized water to remove the heat generated by the laser from the bar in time, and the heat dissipation efficiency is high. ...

Claims

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