High-temperature hard solder quasi-continuous semiconductor laser bar stack encapsulating method

A packaging method and hard solder technology, applied in the laser field, can solve the problems of easy cracking of bars and laser failure, etc., and achieve the effect of short cycle time and improved service life

Active Publication Date: 2013-12-18
SUZHOU INST OF BIOMEDICAL ENG & TECH CHINESE ACADEMY OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the high temperature hard solder is easy to cause a large strain on the bar, and the large welding stress makes the bar easy to crack, resulting in the failure of the laser

Method used

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  • High-temperature hard solder quasi-continuous semiconductor laser bar stack encapsulating method
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  • High-temperature hard solder quasi-continuous semiconductor laser bar stack encapsulating method

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Embodiment Construction

[0033] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0034] refer to figure 1 , figure 2 , image 3 , Figure 4 Shown, a kind of high-temperature hard solder quasi-continuous semiconductor laser bar stack packaging method comprises the following steps:

[0035] Step 1) Place an ultra-flat alumina 7 on the bottom surface of the first fixture, first place an ultra-flat alumina 7 on the bottom surface of the first fixture, and then place another ultra-flat alumina 7 from one end, several conductive Heat dissipation spacers 3, the conductive heat dissipation spacers are spaced equally apart by laser bars 2 and high-temperature hard solder 1, and spring pins or screws are placed at the other end of the first tooling fixture to fasten the laser bars. 2. The high-temperature hard solder 1 and the conductive and heat-dissipating spacer 3 are fixed; or the two welding surfaces of ...

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Abstract

The invention discloses a high-temperature hard solder quasi-continuous semiconductor laser bar stack encapsulating method. n bars, n+1 conductive cooling partition blocks and n+1 electric-insulating cooling fins are stacked alternately and welded in a reflowing mode at one time through high-temperature hard solder with a special tool clamp to form a laser bar stack unit, and then the laser bar stack unit and a heat sink are welded in a reflowing mode again through soft solder with relatively low temperature. The method can obviously reduce welding stress in the high-temperature hard solder quasi-continuous semiconductor laser bar stack encapsulating process, prolong the service life of devices and improve the output rate and the photoelectric performance.

Description

technical field [0001] The invention relates to the field of laser technology, in particular to a bar-stack packaging method for high-temperature hard solder quasi-continuous semiconductor lasers. Background technique [0002] Due to its small size, light weight, and high electro-optical conversion efficiency, semiconductor lasers are widely used in industries, medical care, communications, military defense and other fields. The application market has higher and higher requirements for high power, especially the peak power of quasi-continuous output, and the high-power vertical stack and area array assembled by multiple bars have developed rapidly. [0003] At present, the high-power vertical stacks assembled by multiple bars are mainly stacked with single-bar semiconductor lasers packaged in micro-channel heat sinks. The micro-channel heat sink uses deionized water to remove the heat generated by the laser from the bar in time, and the heat dissipation efficiency is high. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/022H01S5/40
Inventor 江先锋张丽芳孙博书张爱鲁李江
Owner SUZHOU INST OF BIOMEDICAL ENG & TECH CHINESE ACADEMY OF SCI
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