Method for processing a workpiece by means of a numerically controlled workpiece processing device and workpiece processing device

A digital control and workpiece technology, applied in general control systems, program control, manufacturing tools, etc., can solve problems such as time-consuming, cost-effective, and unfavorable, and achieve the effect of simplified evaluation and efficient optimization

Active Publication Date: 2017-08-04
TRUMPF LASERSYST FOR SEMICON MFG
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In particular due to the two sequential steps (processing and measuring), the method as a whole is very time-consuming and therefore not very cost-effective

Method used

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  • Method for processing a workpiece by means of a numerically controlled workpiece processing device and workpiece processing device
  • Method for processing a workpiece by means of a numerically controlled workpiece processing device and workpiece processing device
  • Method for processing a workpiece by means of a numerically controlled workpiece processing device and workpiece processing device

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Embodiment Construction

[0026] figure 1 A workpiece processing device 10 embodied as a laser processing device with a (laser) tool 12 is shown in side view. To machine workpiece 14 , tool 12 is movable relative to workpiece 14 along / around a plurality of movement axes 18 by means of a plurality of actuating drives 16 . An optical distance measuring device 20 arranged on the tool 12 is used to measure a corresponding working distance 22 between the tool 12 and the workpiece 14 . The distance measuring device 20 can alternatively also be designed as a capacitive distance measuring device.

[0027] The numerical control device 24 includes a computer 26 , an input unit 28 connected to the computer 26 and a display 30 . The computer 26 is connected via a control line 32 to the servomotor 16 and the distance measuring device 20 of the tool 12 and is used for the movement control of the tool 12 along the target tool path 34 specified by the control device 24 and for adjusting the working distance 22 of th...

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PUM

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Abstract

The invention relates to a method for machining identically configured workpieces (14) by means of a numerically controlled workpiece processing device (10), the method having the following steps: The workpiece (14) is machined with the nominal tool path (34) of the tool (12), the working distance (22) between the tool (12) and the workpiece (14) is adjusted to the defined nominal distance, so that The tool (12) moves on a pitch-adjusted actual toolpath (36) while machining the workpiece along the nominal toolpath (34), according to the pitch-adjusted actual toolpath (36) of the workpiece (14) being machined. The toolpath ( 36 ) optimizes the setpoint toolpath ( 34 ) for the other workpiece ( 4 ) and processes the other workpiece ( 14 ) given the optimized setpoint toolpath ( 34 ′) and / or according to The pitch-adjusted actual tool path ( 36 ) evaluates the workpiece quality of the workpiece ( 14 ) being machined.

Description

technical field [0001] The invention relates to a method for machining identically constructed workpieces by means of a numerically controlled (NC) workpiece processing device and a workpiece processing device for such a method. Background technique [0002] In such workpiece machining devices, the positioning and movement of tools used in machining the workpiece relative to the workpiece are controlled by means of a numerical control device. During the machining of a workpiece, the tool is moved relative to the tool along a tool path, which is usually determined on the basis of CAD data (CAD / CAM) about the target geometry of the workpiece. The tool path is coded by NC data describing the path, which is stored in the control unit and processed by means of an NC program when machining the workpiece. [0003] In practice, however, workpieces often have geometrical deviations from the CAD target geometry. For this reason, in particular workpieces obtained by forming processes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/408B23K26/08B23K26/04
CPCB23K26/048B23K26/0876G05B19/4083G05B2219/37573G05B19/402
Inventor W·瓦登
Owner TRUMPF LASERSYST FOR SEMICON MFG
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